Ceramic-resin hybrid substrate-based printed capacitors are fabricated for next generation ceramic packaging. The resin solution is infiltrated into the non-sintered ceramic powder beds by either inkjet printing or spin-coating. The amount of infiltrated resin and its spatial distribution throughout the films critically influence the dielectric loss factor, the adhesion strength, and the electrical conductivity of the electrodes. Although inkjet printing leads to non-uniform distribution of the resin, spin-coating is an effective means to uniformly infiltrate the resin solution. The resulting non-sintering ceramic-resin hybrid substrate-based printed capacitors demonstrate optimal properties comparable to their state-of-the-art low-temperature co-fired ceramic (LTCC) counterparts.
Bibliographical noteFunding Information:
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (MEST) (Nos. 2012R1A3A2026417 and 2011-8-2048 ). It was also partly supported by the Second Stage of the Brain Korea 21 Project.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Ceramics and Composites
- Process Chemistry and Technology
- Surfaces, Coatings and Films
- Materials Chemistry