InGaP/GaAs HBT power amplifier based on flexible printed circuit board

Seong Sik Myoung, Sang Hoon Cheon, Jae Woo Park, Jin Sang Jang, Moon Ho Dong, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents InGaP/GaAs hetero-junction bipolar transistor (HBT) power amplifier based on flexible printed circuit board (FPCB) for 5.2 GHz band. FPCB is suitable to fabricate light weigh and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface by its flexible enough to be rolled up like paper. But, the conventional FPCB such as kapton based FPCB shows very high loss characteristic and it is not profitably employed for the frequency band over several tens or hundreds MHz. In this paper, we proposed the power amplifier integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing (OFDM) communication system. The proposed power amplifier is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. The measured result of the proposed amplifiers shows gain of 25 dB and output power of 17 dBm.

Original languageEnglish
Title of host publication2006 Asia-Pacific Microwave Conference Proceedings, APMC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1747-1750
Number of pages4
ISBN (Print)4902339102, 9784902339109
DOIs
Publication statusPublished - 2006
Event2006 Asia-Pacific Microwave Conference, APMC - Yokohama, Japan
Duration: 2006 Dec 122006 Dec 15

Publication series

NameAsia-Pacific Microwave Conference Proceedings, APMC
Volume3

Other

Other2006 Asia-Pacific Microwave Conference, APMC
CountryJapan
CityYokohama
Period06/12/1206/12/15

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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