Initial study on the effect of mold copper thickness on sticker, flux entrapment and bleeder events at U. S. Steel

Il Sohn, Thomas J. Piccone, Thinium T. Natarajan, William K. Schlichting

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Although the mechanisms of in-mold events such as stickers, flux entrapments, and corner bleeders have been well established and documented, there has been a lack of understanding concerning how the copper thickness affects the frequency of these events. As the casters continue to push the boundaries of machine design, the copper molds are exposed to higher numbers of heats per campaign and more campaigns per copper set. This results in thinner coppers on both the broad faces and narrow faces of the mold as refurbished coppers continue to be extensively used. Although the copper alloys and mold coatings developed have some effect on heat transfer the amount of copper lost during refurbishment also has a significant impact on the amount of heat extracted through the water-cooled copper mold and on mold flux performance. In this investigation, the effect of copper thickness on the frequency of in-mold events such as stickers, flux entrapments, and corner bleeders has been studied at United States Steel Corporation ("U. S. Steel") with respect to steel grade type and mold flux.

Original languageEnglish
Title of host publicationAISTech 2009 - Proceedings of the Iron and Steel Technology Conference
Pages1217-1224
Number of pages8
Volume1
Publication statusPublished - 2009 Oct 19
EventIron and Steel Technology Conference, AISTech 2009 - St. Louis, MO, United States
Duration: 2009 May 42009 May 7

Other

OtherIron and Steel Technology Conference, AISTech 2009
CountryUnited States
CitySt. Louis, MO
Period09/5/409/5/7

Fingerprint

Fluxes
Copper
Steel
Machine design
Copper alloys
Molds
Heat transfer
Coatings
Water
Industry
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering

Cite this

Sohn, I., Piccone, T. J., Natarajan, T. T., & Schlichting, W. K. (2009). Initial study on the effect of mold copper thickness on sticker, flux entrapment and bleeder events at U. S. Steel. In AISTech 2009 - Proceedings of the Iron and Steel Technology Conference (Vol. 1, pp. 1217-1224)
Sohn, Il ; Piccone, Thomas J. ; Natarajan, Thinium T. ; Schlichting, William K. / Initial study on the effect of mold copper thickness on sticker, flux entrapment and bleeder events at U. S. Steel. AISTech 2009 - Proceedings of the Iron and Steel Technology Conference. Vol. 1 2009. pp. 1217-1224
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Sohn, I, Piccone, TJ, Natarajan, TT & Schlichting, WK 2009, Initial study on the effect of mold copper thickness on sticker, flux entrapment and bleeder events at U. S. Steel. in AISTech 2009 - Proceedings of the Iron and Steel Technology Conference. vol. 1, pp. 1217-1224, Iron and Steel Technology Conference, AISTech 2009, St. Louis, MO, United States, 09/5/4.

Initial study on the effect of mold copper thickness on sticker, flux entrapment and bleeder events at U. S. Steel. / Sohn, Il; Piccone, Thomas J.; Natarajan, Thinium T.; Schlichting, William K.

AISTech 2009 - Proceedings of the Iron and Steel Technology Conference. Vol. 1 2009. p. 1217-1224.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Sohn I, Piccone TJ, Natarajan TT, Schlichting WK. Initial study on the effect of mold copper thickness on sticker, flux entrapment and bleeder events at U. S. Steel. In AISTech 2009 - Proceedings of the Iron and Steel Technology Conference. Vol. 1. 2009. p. 1217-1224