We used the inkjet printing method to fabricate alumina-resin hybrid films without a high temperature sintering process. The dielectric properties of the alumina-resin hybrid films were studied in order to assess if the alumina-resin hybrid films are applicable to the electronic package substrates. Various numerical models were introduced to understand the relative permittivity of the alumina-resin hybrid films. Q-values of the alumina-resin hybrid films are also measured and compared to the commercially available substrate materials. The impact of microvoids on the Q-value of the inkjet-printed alumina-resin hybrid films was also studied. The microstructures of the inkjet-printed hybrid materials were investigated in order to confirm if the microvoids in the films were filled with the resin.
Bibliographical noteFunding Information:
This research was supported by the core material development program, Ministry of Knowledge Economy, Korea under Grant No. M2007010011. This paper was presented at the international conference on flexible and printed electronics, Jeju, Korea 2009 (TA4-OR-03).
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)