We used the inkjet printing method to fabricate alumina-resin hybrid films without a high temperature sintering process. The dielectric properties of the alumina-resin hybrid films were studied in order to assess if the alumina-resin hybrid films are applicable to the electronic package substrates. Various numerical models were introduced to understand the relative permittivity of the alumina-resin hybrid films. Q-values of the alumina-resin hybrid films are also measured and compared to the commercially available substrate materials. The impact of microvoids on the Q-value of the inkjet-printed alumina-resin hybrid films was also studied. The microstructures of the inkjet-printed hybrid materials were investigated in order to confirm if the microvoids in the films were filled with the resin.
|Title of host publication||Conference Record of the 29th Asilomar Conference on Signals, Systems and Computers, ACSSC 1995|
|Publisher||IEEE Computer Society|
|Publication status||Published - 1995|
|Event||29th Asilomar Conference on Signals, Systems and Computers, ACSSC 1995 - Pacific Grove, United States|
Duration: 1995 Oct 30 → 1995 Nov 1
|Name||Conference Record - Asilomar Conference on Signals, Systems and Computers|
|Conference||29th Asilomar Conference on Signals, Systems and Computers, ACSSC 1995|
|Period||95/10/30 → 95/11/1|
Bibliographical noteFunding Information:
This research was supported by the core material development program, Ministry of Knowledge Economy, Korea under Grant No. M2007010011. This paper was presented at the international conference on flexible and printed electronics, Jeju, Korea 2009 (TA4-OR-03).
© 2010 American Institute of Physics.
All Science Journal Classification (ASJC) codes
- Signal Processing
- Computer Networks and Communications