Integrated carbon nanotube arrays for reliable contact in electromechanical memory device

Jungwook Choi, Youngkee Eun, Jongbaeg Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A reliable electromechanical memory device using aligned carbon nanotube (CNT) arrays as contact material has been developed. The aligned CNT arrays were integrated by chemical vapor deposition (CVD) on microstructures making mechanical contact. The contact showed hysteretic pull-out and -in behaviors which enabled on- and off-state readout, and the memory logic was programmed based on adhesive force between the CNT arrays and actuation of shuttle. On the basis of intimate interfacial contact between CNT arrays, and remarkable electrical and mechanical properties of CNT, the reliability experiment showed durable contact characteristic for over 1.1×10 6 cycles of 20 mA hot-switching operation.

Original languageEnglish
Title of host publication2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages1316-1319
Number of pages4
DOIs
Publication statusPublished - 2012 May 7
Event2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France
Duration: 2012 Jan 292012 Feb 2

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
CountryFrance
CityParis
Period12/1/2912/2/2

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Choi, J., Eun, Y., & Kim, J. (2012). Integrated carbon nanotube arrays for reliable contact in electromechanical memory device. In 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 (pp. 1316-1319). [6170400] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2012.6170400