Integration challenges of III-V materials in advanced CMOS logic

R. J.W. Hill, J. Huang, W. Y. Loh, T. Kim, M. H. Wong, D. Veksler, T. H. Cunningham, R. Droopad, J. Oh, C. Hobbs, P. D. Kirsch, R. Jammy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint

Dive into the research topics of 'Integration challenges of III-V materials in advanced CMOS logic'. Together they form a unique fingerprint.

Engineering & Materials Science