This paper presents a low-temperature co-fired ceramic (LTCC) package incorporating an integrated ultra-wide-band (UWB) antenna, antenna-feeding network, and internal space for integration of a compact UWB transceiver chip. The area underneath a planar monopole antenna ground plane is utilized for integration of transceiver components. The LTCC package has overall dimensions of 20 × 20 × 1.2 mm3. The measured bandwidth of the integrated UWB antenna is 6.4 GHz starting from 4.75 to 11.15 GHz and the radiation patterns are suitable for indoor wireless communication environment. The fabricated package reveals reasonable time-domain characteristics. In addition, the practical application of the proposed package geometry is discussed.
|Number of pages||8|
|Journal||IEEE Transactions on Components, Packaging and Manufacturing Technology|
|Publication status||Published - 2011 Dec 1|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering