This paper presents a low-temperature co-fired ceramic (LTCC) package incorporating an integrated ultra-wide-band (UWB) antenna, antenna-feeding network, and internal space for integration of a compact UWB transceiver chip. The area underneath a planar monopole antenna ground plane is utilized for integration of transceiver components. The LTCC package has overall dimensions of 20 × 20 × 1.2 mm3. The measured bandwidth of the integrated UWB antenna is 6.4 GHz starting from 4.75 to 11.15 GHz and the radiation patterns are suitable for indoor wireless communication environment. The fabricated package reveals reasonable time-domain characteristics. In addition, the practical application of the proposed package geometry is discussed.
|Number of pages||8|
|Journal||IEEE Transactions on Components, Packaging and Manufacturing Technology|
|Publication status||Published - 2011|
Bibliographical noteFunding Information:
Manuscript received August 19, 2008; revised February 18, 2009, July 11, 2009, and November 29, 2009; accepted October 18, 2010. Date of publication January 20, 2011; date of current version March 23, 2011. This work was supported by the MKE (Ministry of Knowledge Economy), Korea, under the ITRC (Information Technology Research Center) support program supervised by the IITA (Institute of Information Technology Advancement) (IITA-2008-(C1090-0801-0034). This work was recommended for publication by Associate Editor M. Tentzeris upon evaluation of the reviewers comments.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering