Integration of bulk materials with two-dimensional materials for physical coupling and applications

Sang Hoon Bae, Hyun Kum, Wei Kong, Yunjo Kim, Chanyeol Choi, Byunghun Lee, Peng Lin, Yongmo Park, Jeehwan Kim

Research output: Contribution to journalReview articlepeer-review

86 Citations (Scopus)

Abstract

Hybrid heterostructures are essential for functional device systems. The advent of 2D materials has broadened the material set beyond conventional 3D material-based heterostructures. It has triggered the fundamental investigation and use in applications of new coupling phenomena between 3D bulk materials and 2D atomic layers that have unique van der Waals features. Here we review the state-of-the-art fabrication of 2D and 3D heterostructures, present a critical survey of unique phenomena arising from forming 3D/2D interfaces, and introduce their applications. We also discuss potential directions for research based on these new coupled architectures.

Original languageEnglish
Pages (from-to)550-560
Number of pages11
JournalNature materials
Volume18
Issue number6
DOIs
Publication statusPublished - 2019 Jun 1

Bibliographical note

Publisher Copyright:
© 2019, Springer Nature Limited.

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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