Interfacial self-Cleaning during PEALD HfO2 process on GaAs using TDMAH/O2 with different (NH4)2S cleaning time

Young Chul Byun, Chee Hong An, Ju Yun Choi, Chung Yi Kim, Mann Ho Cho, Hyoungsub Kim

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

This study presents an examination of the interfacial and electrical properties of HfO2 films grown by plasma-enhanced atomic layer deposition with tetrakis(diethylmethylamino) hafnium and O2 precursors on GaAs substrates cleaned with HF and then (NH4) 2S cleaning for three different dipping times. Systematic X-ray photoelectron spectroscopy analyses both before and after the HfO2 deposition revealed that the optimal cleaning time in terms of the removal of the As- and Ga-oxides was significantly reduced by the partial self-cleaning process that occurred at a substantially lower deposition temperature of only 200C, possibly due to the plasma effect. The frequency dispersion characteristics were strongly dependent on the cleaning method, however, the hysteresis characteristics were not.

Original languageEnglish
Pages (from-to)G141-G145
JournalJournal of the Electrochemical Society
Volume158
Issue number6
DOIs
Publication statusPublished - 2011 May 4

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Interfacial self-Cleaning during PEALD HfO<sub>2</sub> process on GaAs using TDMAH/O<sub>2</sub> with different (NH<sub>4</sub>)<sub>2</sub>S cleaning time'. Together they form a unique fingerprint.

  • Cite this