Interfacial Stress Concentrations of Vertical Through-plate to H-beam Connections in CFT Column

Insub Choi, Hak Jong Chang, Jun Hee Kim

Research output: Contribution to journalArticlepeer-review


This paper aims to evaluate the interfacial stress concentrations on connection between vertical through-plate and H-beam in CFT column. Full-scale experiments were performed on three specimens with varying thickness of the vertical through-plate to investigate the interfacial stress concentration factor in the connections. The specimens underwent brittle failure at the location where the steel beam is connected to the vertical through-plate before the steel beam reached its plastic moment. The strain data of the part were analyzed, and the sectional analyses were conducted to determine appropriate residual stress models. In addition, the stress concentration factor was quantified by comparing the analytical local behavior in which the stress concentration is not reflected and the experimental data reflecting the stress concentration. The results showed that the maximum reduction of the stress concentration factor due to an increase in the thickness of the vertical through-plate is 50.3%.

Original languageEnglish
Pages (from-to)325-334
Number of pages10
JournalInternational Journal of High-Rise Buildings
Issue number4
Publication statusPublished - 2020

Bibliographical note

Funding Information:
This research was supported by a grant (NRF-2018 R1A2B6006958) from the National Research Foundation of Korea (NRF) funded by the Korean Ministry of Science and ICT (MSIT).

Publisher Copyright:
© 2020, International Journal of High-Rise Buildings. All Rights Reserved

All Science Journal Classification (ASJC) codes

  • Architecture
  • Civil and Structural Engineering
  • Building and Construction
  • Urban Studies


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