Investigation on the atomic layer deposition of the Se doped Sb–Te phase change films using an alkyl-silyl precursor

Jin Hwan Jeong, Doo Jin Choi

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

We used TDMASb, Te(t-Bu)2, and Se(SiMe3)2 as precursors to investigate the behavior of atomic vapor deposition (AVD) during formation of Se doped Sb–Te phase change films. The deposition was prepared by a sequential recipe for the atomic layer deposition (ALD) reaction with consideration of the electrostatic interactions between the Se alkyl-silyl precursor and the Sb and Te precursors. The Sb–Te–Se ternary films could be deposited by AVD at temperatures of 80–300 °C with fine controllability and high surface quality. The elemental composition of the films was controlled by varying the deposition temperature. The Se doping effect on the crystallization temperature and set resistance in the crystalline state was evaluated via electrical measurements and theoretical analyses by applying the glass transition temperature model and resonance bonding model. The results indicated that the incorporation of Se into Sb–Te films may provide for improved thermal stability and power consumption efficiency in phase-change random access memory (PCRAM) devices.

Original languageEnglish
Pages (from-to)42-50
Number of pages9
JournalMaterials Science in Semiconductor Processing
Volume54
DOIs
Publication statusPublished - 2016 Nov 1

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Atomic layer deposition
atomic layer epitaxy
Vapor deposition
vapor deposition
turbogenerators
controllability
random access memory
Crystallization
Coulomb interactions
Controllability
Temperature
glass transition temperature
electrical measurement
Surface properties
temperature
Thermodynamic stability
Electric power utilization
thermal stability
Doping (additives)
crystallization

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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abstract = "We used TDMASb, Te(t-Bu)2, and Se(SiMe3)2 as precursors to investigate the behavior of atomic vapor deposition (AVD) during formation of Se doped Sb–Te phase change films. The deposition was prepared by a sequential recipe for the atomic layer deposition (ALD) reaction with consideration of the electrostatic interactions between the Se alkyl-silyl precursor and the Sb and Te precursors. The Sb–Te–Se ternary films could be deposited by AVD at temperatures of 80–300 °C with fine controllability and high surface quality. The elemental composition of the films was controlled by varying the deposition temperature. The Se doping effect on the crystallization temperature and set resistance in the crystalline state was evaluated via electrical measurements and theoretical analyses by applying the glass transition temperature model and resonance bonding model. The results indicated that the incorporation of Se into Sb–Te films may provide for improved thermal stability and power consumption efficiency in phase-change random access memory (PCRAM) devices.",
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AU - Choi, Doo Jin

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N2 - We used TDMASb, Te(t-Bu)2, and Se(SiMe3)2 as precursors to investigate the behavior of atomic vapor deposition (AVD) during formation of Se doped Sb–Te phase change films. The deposition was prepared by a sequential recipe for the atomic layer deposition (ALD) reaction with consideration of the electrostatic interactions between the Se alkyl-silyl precursor and the Sb and Te precursors. The Sb–Te–Se ternary films could be deposited by AVD at temperatures of 80–300 °C with fine controllability and high surface quality. The elemental composition of the films was controlled by varying the deposition temperature. The Se doping effect on the crystallization temperature and set resistance in the crystalline state was evaluated via electrical measurements and theoretical analyses by applying the glass transition temperature model and resonance bonding model. The results indicated that the incorporation of Se into Sb–Te films may provide for improved thermal stability and power consumption efficiency in phase-change random access memory (PCRAM) devices.

AB - We used TDMASb, Te(t-Bu)2, and Se(SiMe3)2 as precursors to investigate the behavior of atomic vapor deposition (AVD) during formation of Se doped Sb–Te phase change films. The deposition was prepared by a sequential recipe for the atomic layer deposition (ALD) reaction with consideration of the electrostatic interactions between the Se alkyl-silyl precursor and the Sb and Te precursors. The Sb–Te–Se ternary films could be deposited by AVD at temperatures of 80–300 °C with fine controllability and high surface quality. The elemental composition of the films was controlled by varying the deposition temperature. The Se doping effect on the crystallization temperature and set resistance in the crystalline state was evaluated via electrical measurements and theoretical analyses by applying the glass transition temperature model and resonance bonding model. The results indicated that the incorporation of Se into Sb–Te films may provide for improved thermal stability and power consumption efficiency in phase-change random access memory (PCRAM) devices.

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