Abstract
This paper presents the development status of joint method between the superconducting YBCO coated conductors (YBCO CC). In general, the YBCO-CC tape consists of an upper stabilizer, substrate, buffer, YBCO and a bottom stabilizer. It is suggested that the stabilizer between the two YBCO-CC tapes need to be removed, in order to improve the characteristics of the joints. The removing process was conducted by using heat and partial etching. The resistance and critical current of the joints were measured from the V - I curve. The optical micrographs were analyzed for microstructures between the joint areas. After several times of over current test, the critical currents of the various types of joint samples were examined for applying to the high temperature superconducting magnet system.
Original language | English |
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Article number | 4511473 |
Pages (from-to) | 1220-1223 |
Number of pages | 4 |
Journal | IEEE Transactions on Applied Superconductivity |
Volume | 18 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2008 Jun |
Bibliographical note
Funding Information:Manuscript received August 29, 2007. This work was supported by KESRI(R-2005-7-090), which is funded by MOCIE (Ministry of commerce, industry and energy). K. S. Chang, H. Kim, D. K. Park and T. K. Ko are with the Electrical & Electronic Engineering Department, Yonsei University, Seoul, 120-749, Korea. M. C. Ahn is with FBML/MIT, Cambridge, MA 02139, USA. S. J. Lee is with the Department of Electrical Engineering, Uiduk University, Kyoungju, Korea. H. M. Kim is with Korea Electrotechnology Research Institute, Changwon, Korea. D.-H. Ha, J.-B. Song and H. G. Lee are with the Department of Material Science and Engineering, Korea University, Seoul, Korea (e-mail: haigunlee@korea.ac.kr). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TASC.2008.920811
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering