Joint structure in high brightness light emitting diode (HB LED) packages

Jin Woo Park; Young Bok Yoon; Sang Hyun Shin; Sang Hyun Choi

doi:10.1016/j.msea.2006.09.043

Joint structure in high brightness light emitting diode (HB LED) packages

Jin Woo Park, Young Bok Yoon, Sang Hyun Shin, Sang Hyun Choi

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

25 Citations (Scopus)

Abstract

We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.

Original language	English
Pages (from-to)	357-361
Number of pages	5
Journal	Materials Science and Engineering A
Volume	441
Issue number	1-2
DOIs	https://doi.org/10.1016/j.msea.2006.09.043
Publication status	Published - 2006 Dec 15

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.msea.2006.09.043

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title = "Joint structure in high brightness light emitting diode (HB LED) packages",

abstract = "We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.",

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AU - Park, Jin Woo

AU - Yoon, Young Bok

AU - Shin, Sang Hyun

AU - Choi, Sang Hyun

PY - 2006/12/15

Y1 - 2006/12/15

N2 - We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.

AB - We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.

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JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

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