TY - JOUR
T1 - Joint structure in high brightness light emitting diode (HB LED) packages
AU - Park, Jin Woo
AU - Yoon, Young Bok
AU - Shin, Sang Hyun
AU - Choi, Sang Hyun
PY - 2006/12/15
Y1 - 2006/12/15
N2 - We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.
AB - We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.
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U2 - 10.1016/j.msea.2006.09.043
DO - 10.1016/j.msea.2006.09.043
M3 - Article
AN - SCOPUS:33750606280
VL - 441
SP - 357
EP - 361
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
SN - 0921-5093
IS - 1-2
ER -