Abstract
We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.
| Original language | English |
|---|---|
| Pages (from-to) | 357-361 |
| Number of pages | 5 |
| Journal | Materials Science and Engineering A |
| Volume | 441 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 2006 Dec 15 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
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Joint structure in high brightness light emitting diode (HB LED) packages. / Park, Jin Woo; Yoon, Young Bok; Shin, Sang Hyun; Choi, Sang Hyun.
In: Materials Science and Engineering A, Vol. 441, No. 1-2, 15.12.2006, p. 357-361.Research output: Contribution to journal › Article
TY - JOUR
T1 - Joint structure in high brightness light emitting diode (HB LED) packages
AU - Park, Jin Woo
AU - Yoon, Young Bok
AU - Shin, Sang Hyun
AU - Choi, Sang Hyun
PY - 2006/12/15
Y1 - 2006/12/15
N2 - We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.
AB - We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.
UR - http://www.scopus.com/inward/record.url?scp=33750606280&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33750606280&partnerID=8YFLogxK
U2 - 10.1016/j.msea.2006.09.043
DO - 10.1016/j.msea.2006.09.043
M3 - Article
AN - SCOPUS:33750606280
VL - 441
SP - 357
EP - 361
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
SN - 0921-5093
IS - 1-2
ER -