Kinetically controlled, adhesiveless transfer printing using microstructured stamps

Tae Ho Kim, Andrew Carlson, Jong Hyun Ahn, Sang Min Won, Shuodao Wang, Yonggang Huang, John A. Rogers

Research output: Contribution to journalArticle

70 Citations (Scopus)

Abstract

This letter describes the physics and application of an approach to transfer printing that uses stamps with microstructures of relief embossed into their surfaces. Experimental measurement of velocity-dependent adhesive strength as a function of relief geometry reveals key scaling properties and provides a means for comparison to theoretical expectation. Formation of transistor devices that use nanoribbons of silicon transfer printed directly onto glass substrates without adhesive layers demonstrates the use of this type of approach for a high-performance (mobilities > 325 cm2 /V s and on/off ratios > 105) single crystal silicon on glass technology.

Original languageEnglish
Article number113502
JournalApplied Physics Letters
Volume94
Issue number11
DOIs
Publication statusPublished - 2009 Mar 31

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Fingerprint Dive into the research topics of 'Kinetically controlled, adhesiveless transfer printing using microstructured stamps'. Together they form a unique fingerprint.

  • Cite this

    Kim, T. H., Carlson, A., Ahn, J. H., Won, S. M., Wang, S., Huang, Y., & Rogers, J. A. (2009). Kinetically controlled, adhesiveless transfer printing using microstructured stamps. Applied Physics Letters, 94(11), [113502]. https://doi.org/10.1063/1.3099052