KitFox

Multiphysics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture

William Jinho Song, Saibal Mukhopadhyay, Sudhakar Yalamanchili

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

With continued technology scaling and increased power and thermal densities, processor operation and performance are increasingly dominated by physical phenomena. Microarchitectural approaches to mitigate these effects must be based on a profound understanding of how the physics is manifested in microarchitectural executions and system-level properties, such as performance, energy efficiency, or lifetime reliability. This requires a modeling and simulation environment that incorporates multiple physical phenomena and their concurrent interactions with microarchitecture. In this paper, we introduce an integrated power, thermal, and reliability modeling framework, KitFox. The goal of KitFox framework is to facilitate research explorations at the intersection of applications, microarchitectures, and various physical phenomena, including energy, power, thermal, cooling, and reliability. The KitFox framework implements a standard interface to bridge multiple physical models, where individual models are encapsulated into libraries and are interchangeable. This paper describes the design methodology of the library framework that orchestrates various implementations of physical models and standardized interface to cycle-level microarchitecture simulators. Several use cases are presented to demonstrate the range of modeling capabilities of KitFox.

Original languageEnglish
Article number7305768
Pages (from-to)1590-1601
Number of pages12
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume5
Issue number11
DOIs
Publication statusPublished - 2015 Nov 1

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Energy efficiency
Physics
Simulators
Cooling
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

@article{d5bddce8695a45a1b068ffe0e45d5828,
title = "KitFox: Multiphysics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture",
abstract = "With continued technology scaling and increased power and thermal densities, processor operation and performance are increasingly dominated by physical phenomena. Microarchitectural approaches to mitigate these effects must be based on a profound understanding of how the physics is manifested in microarchitectural executions and system-level properties, such as performance, energy efficiency, or lifetime reliability. This requires a modeling and simulation environment that incorporates multiple physical phenomena and their concurrent interactions with microarchitecture. In this paper, we introduce an integrated power, thermal, and reliability modeling framework, KitFox. The goal of KitFox framework is to facilitate research explorations at the intersection of applications, microarchitectures, and various physical phenomena, including energy, power, thermal, cooling, and reliability. The KitFox framework implements a standard interface to bridge multiple physical models, where individual models are encapsulated into libraries and are interchangeable. This paper describes the design methodology of the library framework that orchestrates various implementations of physical models and standardized interface to cycle-level microarchitecture simulators. Several use cases are presented to demonstrate the range of modeling capabilities of KitFox.",
author = "Song, {William Jinho} and Saibal Mukhopadhyay and Sudhakar Yalamanchili",
year = "2015",
month = "11",
day = "1",
doi = "10.1109/TCPMT.2015.2485158",
language = "English",
volume = "5",
pages = "1590--1601",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "11",

}

KitFox : Multiphysics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture. / Song, William Jinho; Mukhopadhyay, Saibal; Yalamanchili, Sudhakar.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 11, 7305768, 01.11.2015, p. 1590-1601.

Research output: Contribution to journalArticle

TY - JOUR

T1 - KitFox

T2 - Multiphysics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture

AU - Song, William Jinho

AU - Mukhopadhyay, Saibal

AU - Yalamanchili, Sudhakar

PY - 2015/11/1

Y1 - 2015/11/1

N2 - With continued technology scaling and increased power and thermal densities, processor operation and performance are increasingly dominated by physical phenomena. Microarchitectural approaches to mitigate these effects must be based on a profound understanding of how the physics is manifested in microarchitectural executions and system-level properties, such as performance, energy efficiency, or lifetime reliability. This requires a modeling and simulation environment that incorporates multiple physical phenomena and their concurrent interactions with microarchitecture. In this paper, we introduce an integrated power, thermal, and reliability modeling framework, KitFox. The goal of KitFox framework is to facilitate research explorations at the intersection of applications, microarchitectures, and various physical phenomena, including energy, power, thermal, cooling, and reliability. The KitFox framework implements a standard interface to bridge multiple physical models, where individual models are encapsulated into libraries and are interchangeable. This paper describes the design methodology of the library framework that orchestrates various implementations of physical models and standardized interface to cycle-level microarchitecture simulators. Several use cases are presented to demonstrate the range of modeling capabilities of KitFox.

AB - With continued technology scaling and increased power and thermal densities, processor operation and performance are increasingly dominated by physical phenomena. Microarchitectural approaches to mitigate these effects must be based on a profound understanding of how the physics is manifested in microarchitectural executions and system-level properties, such as performance, energy efficiency, or lifetime reliability. This requires a modeling and simulation environment that incorporates multiple physical phenomena and their concurrent interactions with microarchitecture. In this paper, we introduce an integrated power, thermal, and reliability modeling framework, KitFox. The goal of KitFox framework is to facilitate research explorations at the intersection of applications, microarchitectures, and various physical phenomena, including energy, power, thermal, cooling, and reliability. The KitFox framework implements a standard interface to bridge multiple physical models, where individual models are encapsulated into libraries and are interchangeable. This paper describes the design methodology of the library framework that orchestrates various implementations of physical models and standardized interface to cycle-level microarchitecture simulators. Several use cases are presented to demonstrate the range of modeling capabilities of KitFox.

UR - http://www.scopus.com/inward/record.url?scp=84948579050&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84948579050&partnerID=8YFLogxK

U2 - 10.1109/TCPMT.2015.2485158

DO - 10.1109/TCPMT.2015.2485158

M3 - Article

VL - 5

SP - 1590

EP - 1601

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

SN - 2156-3950

IS - 11

M1 - 7305768

ER -