Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate

Hyungsuk Min, Byoungyoon Lee, Sooncheol Jeong, Myeongkyu Lee

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

We here present a simple, low-cost laser-direct process to fabricate conductive Cu patterns on plastic substrate. A Cu nano-ink was synthesized using Cu formate as a precursor. The Cu ink spin-coated on a polyimide substrate was selectively sintered using a pulsed ultraviolet laser beam. The unexposed regions of the coated ink could be removed by rinsing the whole film in the dispersion agent of the synthesized ink, which revealed a conductive Cu pattern. This allowed sintering and patterning to be simultaneously accomplished, with a minimum line width of ~20 μm available. The fabricated pattern remained strongly adhesive to the substrate and exhibited only a slight increase in resistance even after 1000 bending cycles to a radius of curvature of 4.8 mm.

Original languageEnglish
Pages (from-to)12-16
Number of pages5
JournalOptics and Lasers in Engineering
Volume80
DOIs
Publication statusPublished - 2016 May 1

Fingerprint

inks
Metallizing
Ink
adhesives
Adhesives
plastics
Plastics
formic acid
Lasers
Substrates
lasers
Ultraviolet lasers
formates
ultraviolet lasers
Pulsed lasers
polyimides
Polyimides
Linewidth
Laser beams
pulsed lasers

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

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Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate. / Min, Hyungsuk; Lee, Byoungyoon; Jeong, Sooncheol; Lee, Myeongkyu.

In: Optics and Lasers in Engineering, Vol. 80, 01.05.2016, p. 12-16.

Research output: Contribution to journalArticle

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