Abstract
We here present a simple, low-cost laser-direct process to fabricate conductive Cu patterns on plastic substrate. A Cu nano-ink was synthesized using Cu formate as a precursor. The Cu ink spin-coated on a polyimide substrate was selectively sintered using a pulsed ultraviolet laser beam. The unexposed regions of the coated ink could be removed by rinsing the whole film in the dispersion agent of the synthesized ink, which revealed a conductive Cu pattern. This allowed sintering and patterning to be simultaneously accomplished, with a minimum line width of ~20 μm available. The fabricated pattern remained strongly adhesive to the substrate and exhibited only a slight increase in resistance even after 1000 bending cycles to a radius of curvature of 4.8 mm.
| Original language | English |
|---|---|
| Pages (from-to) | 12-16 |
| Number of pages | 5 |
| Journal | Optics and Lasers in Engineering |
| Volume | 80 |
| DOIs | |
| Publication status | Published - 2016 May 1 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Mechanical Engineering
- Electrical and Electronic Engineering
Cite this
}
Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate. / Min, Hyungsuk; Lee, Byoungyoon; Jeong, Sooncheol; Lee, Myeongkyu.
In: Optics and Lasers in Engineering, Vol. 80, 01.05.2016, p. 12-16.Research output: Contribution to journal › Article
TY - JOUR
T1 - Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate
AU - Min, Hyungsuk
AU - Lee, Byoungyoon
AU - Jeong, Sooncheol
AU - Lee, Myeongkyu
PY - 2016/5/1
Y1 - 2016/5/1
N2 - We here present a simple, low-cost laser-direct process to fabricate conductive Cu patterns on plastic substrate. A Cu nano-ink was synthesized using Cu formate as a precursor. The Cu ink spin-coated on a polyimide substrate was selectively sintered using a pulsed ultraviolet laser beam. The unexposed regions of the coated ink could be removed by rinsing the whole film in the dispersion agent of the synthesized ink, which revealed a conductive Cu pattern. This allowed sintering and patterning to be simultaneously accomplished, with a minimum line width of ~20 μm available. The fabricated pattern remained strongly adhesive to the substrate and exhibited only a slight increase in resistance even after 1000 bending cycles to a radius of curvature of 4.8 mm.
AB - We here present a simple, low-cost laser-direct process to fabricate conductive Cu patterns on plastic substrate. A Cu nano-ink was synthesized using Cu formate as a precursor. The Cu ink spin-coated on a polyimide substrate was selectively sintered using a pulsed ultraviolet laser beam. The unexposed regions of the coated ink could be removed by rinsing the whole film in the dispersion agent of the synthesized ink, which revealed a conductive Cu pattern. This allowed sintering and patterning to be simultaneously accomplished, with a minimum line width of ~20 μm available. The fabricated pattern remained strongly adhesive to the substrate and exhibited only a slight increase in resistance even after 1000 bending cycles to a radius of curvature of 4.8 mm.
UR - http://www.scopus.com/inward/record.url?scp=84953791725&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84953791725&partnerID=8YFLogxK
U2 - 10.1016/j.optlaseng.2015.12.007
DO - 10.1016/j.optlaseng.2015.12.007
M3 - Article
AN - SCOPUS:84953791725
VL - 80
SP - 12
EP - 16
JO - Optics and Lasers in Engineering
JF - Optics and Lasers in Engineering
SN - 0143-8166
ER -