Laser sintering of Cu paste film printed on polyimide substrate

Myungo Joo, Byoungyoon Lee, Sooncheol Jeong, Myeongkyu Lee

Research output: Contribution to journalArticle

21 Citations (Scopus)

Abstract

We here show that highly conductive copper films are obtainable from Cu paste by laser sintering. The Cu paste synthesized using an organo-metallic compound was screen-printed onto polyimide substrate and the printed films were scanned by an ultraviolet laser beam at 355 nm under nitrogen atmosphere. Very compact microstructure was observed throughout the whole thickness and the sintered films were mechanically robust. Although Cu is known susceptible to oxidation, no Cu oxides were incorporated into the film during laser sintering. An electrical resistivity of 1.86 × 10 -5 Ω cm was obtained. This resistivity is several orders of magnitude lower than those reported for the copper nanoparticle paste thermally sintered under N 2 or H 2 atmosphere.

Original languageEnglish
Pages (from-to)521-524
Number of pages4
JournalApplied Surface Science
Volume258
Issue number1
DOIs
Publication statusPublished - 2011 Oct 15

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Surfaces, Coatings and Films

Cite this