Low-cost realization of ISM Band Pass Filters using integrated combline structures

M. H. Son; Y. J. Kim; S. S. Lee

Low-cost realization of ISM Band Pass Filters using integrated combline structures

M. H. Son, Y. J. Kim, S. S. Lee

Department of Mechanical Engineering

Research output: Contribution to conference › Paper › peer-review

2 Citations (Scopus)

Abstract

The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.

Original language	English
Pages	32
Number of pages	1
Publication status	Published - 2000
Event	12 Asia-Pacific Microwave Conference - Sydney, Australia Duration: 2000 Dec 3 → 2000 Dec 6

Other

Other	12 Asia-Pacific Microwave Conference
City	Sydney, Australia
Period	00/12/3 → 00/12/6

All Science Journal Classification (ASJC) codes

Engineering(all)

Cite this

@conference{e4cba5abf31e438b87e6151afda1758c,

title = "Low-cost realization of ISM Band Pass Filters using integrated combline structures",

abstract = "The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.",

author = "Son, {M. H.} and Kim, {Y. J.} and Lee, {S. S.}",

year = "2000",

language = "English",

pages = "32",

note = "12 Asia-Pacific Microwave Conference ; Conference date: 03-12-2000 Through 06-12-2000",

}

TY - CONF

T1 - Low-cost realization of ISM Band Pass Filters using integrated combline structures

AU - Son, M. H.

AU - Kim, Y. J.

AU - Lee, S. S.

PY - 2000

Y1 - 2000

N2 - The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.

AB - The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.

UR - http://www.scopus.com/inward/record.url?scp=0034459587&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034459587&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0034459587

SP - 32

T2 - 12 Asia-Pacific Microwave Conference

Y2 - 3 December 2000 through 6 December 2000

ER -

Low-cost realization of ISM Band Pass Filters using integrated combline structures

Abstract

Other

All Science Journal Classification (ASJC) codes

Other files and links

Fingerprint

Cite this