Abstract
The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.
| Original language | English |
|---|---|
| Number of pages | 1 |
| Publication status | Published - 2000 Dec 1 |
| Event | 12 Asia-Pacific Microwave Conference - Sydney, Australia Duration: 2000 Dec 3 → 2000 Dec 6 |
Other
| Other | 12 Asia-Pacific Microwave Conference |
|---|---|
| City | Sydney, Australia |
| Period | 00/12/3 → 00/12/6 |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
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Low-cost realization of ISM Band Pass Filters using integrated combline structures. / Son, M. H.; Kim, Y. J.; Lee, S. S.
2000. Paper presented at 12 Asia-Pacific Microwave Conference, Sydney, Australia, .Research output: Contribution to conference › Paper
TY - CONF
T1 - Low-cost realization of ISM Band Pass Filters using integrated combline structures
AU - Son, M. H.
AU - Kim, Y. J.
AU - Lee, S. S.
PY - 2000/12/1
Y1 - 2000/12/1
N2 - The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.
AB - The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.
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M3 - Paper
AN - SCOPUS:0034459587
ER -