The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.
|Number of pages||1|
|Publication status||Published - 2000 Dec 1|
|Event||12 Asia-Pacific Microwave Conference - Sydney, Australia|
Duration: 2000 Dec 3 → 2000 Dec 6
|Other||12 Asia-Pacific Microwave Conference|
|Period||00/12/3 → 00/12/6|
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