Low-cost realization of ISM Band Pass Filters using integrated combline structures

M. H. Son; Y. J. Kim; S. S. Lee

Low-cost realization of ISM Band Pass Filters using integrated combline structures

M. H. Son, Y. J. Kim, S. S. Lee

Department of Mechanical Engineering

Research output: Contribution to conference › Paper › peer-review

2 Citations (Scopus)

Abstract

The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.

Original language	English
Pages	32
Number of pages	1
Publication status	Published - 2000
Event	12 Asia-Pacific Microwave Conference - Sydney, Australia Duration: 2000 Dec 3 → 2000 Dec 6

Other

Other	12 Asia-Pacific Microwave Conference
City	Sydney, Australia
Period	00/12/3 → 00/12/6

All Science Journal Classification (ASJC) codes

Engineering(all)

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title = "Low-cost realization of ISM Band Pass Filters using integrated combline structures",

abstract = "The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.",

author = "Son, {M. H.} and Kim, {Y. J.} and Lee, {S. S.}",

year = "2000",

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AU - Kim, Y. J.

AU - Lee, S. S.

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N2 - The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.

AB - The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4GHz) as Bluetooth and Wireless LAN.

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T2 - 12 Asia-Pacific Microwave Conference

Y2 - 3 December 2000 through 6 December 2000

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