Low temperature and ion-cut based monolithic 3D process integration platform incorporated with CMOS, RRAM and photo-sensor circuits

Hoonhee Han, Rino Choi, Seong Ook Jung, Sung Woo Chung, Byung Jin Cho, S. C. Song, Changhwan Choi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Material Science