Macro-modeling of high-speed digital board to package interconnections

Jung Min Kim, Jin Kyoung Du, Yong Ju Kim, Hyungsoo Kim, Kun Woo Park, Joong Sik Kih, Jong Gwan Yook

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)


The pole and residue values from vector fitting method were applied in this paper, which enables the extraction and implementation of the equivalent circuit to achieve the characteristics of board to package model for GHz frequency range. After the full-wave EM simulation of package model, the mathematical functions are derived by the frequency domain responses of EM simulation. The equivalent circuit model and simulation show good correlation, further verifying the accuracy of the simulated EM data and extracted circuit model. Fourier series of clock pulse to the extracted equivalent circuit provides an approach to tremendously reduced simulation time of the frequency and time domain for the high-speed digital system.

Original languageEnglish
Article number4015343
Pages (from-to)1959-1962
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Publication statusPublished - 2006
Event2006 IEEE MTT-S International Microwave Symposium Digest - San Francisco, CA, United States
Duration: 2006 Jun 112006 Jun 16

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


Dive into the research topics of 'Macro-modeling of high-speed digital board to package interconnections'. Together they form a unique fingerprint.

Cite this