Abstract
The pole and residue values from vector fitting method were applied in this paper, which enables the extraction and implementation of the equivalent circuit to achieve the characteristics of board to package model for GHz frequency range. After the full-wave EM simulation of package model, the mathematical functions are derived by the frequency domain responses of EM simulation. The equivalent circuit model and simulation show good correlation, further verifying the accuracy of the simulated EM data and extracted circuit model. Fourier series of clock pulse to the extracted equivalent circuit provides an approach to tremendously reduced simulation time of the frequency and time domain for the high-speed digital system.
| Original language | English |
|---|---|
| Article number | 4015343 |
| Pages (from-to) | 1959-1962 |
| Number of pages | 4 |
| Journal | IEEE MTT-S International Microwave Symposium Digest |
| DOIs | |
| Publication status | Published - 2006 Dec 1 |
| Event | 2006 IEEE MTT-S International Microwave Symposium Digest - San Francisco, CA, United States Duration: 2006 Jun 11 → 2006 Jun 16 |
All Science Journal Classification (ASJC) codes
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering
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Kim, J. M., Du, J. K., Kim, Y. J., Kim, H., Park, K. W., Kih, J. S., & Yook, J. G. (2006). Macro-modeling of high-speed digital board to package interconnections. IEEE MTT-S International Microwave Symposium Digest, 1959-1962. [4015343]. https://doi.org/10.1109/MWSYM.2006.249818