Macro-modeling of high-speed digital board to package interconnections

Jung Min Kim, Jin Kyoung Du, Yong Ju Kim, Hyungsoo Kim, Kun Woo Park, Joong Sik Kih, Jong Gwan Yook

Research output: Contribution to journalConference article

Abstract

The pole and residue values from vector fitting method were applied in this paper, which enables the extraction and implementation of the equivalent circuit to achieve the characteristics of board to package model for GHz frequency range. After the full-wave EM simulation of package model, the mathematical functions are derived by the frequency domain responses of EM simulation. The equivalent circuit model and simulation show good correlation, further verifying the accuracy of the simulated EM data and extracted circuit model. Fourier series of clock pulse to the extracted equivalent circuit provides an approach to tremendously reduced simulation time of the frequency and time domain for the high-speed digital system.

Original languageEnglish
Article number4015343
Pages (from-to)1959-1962
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
DOIs
Publication statusPublished - 2006 Dec 1
Event2006 IEEE MTT-S International Microwave Symposium Digest - San Francisco, CA, United States
Duration: 2006 Jun 112006 Jun 16

Fingerprint

Macros
equivalent circuits
high speed
Equivalent circuits
simulation
digital systems
Fourier series
Electromagnetic waves
clocks
Clocks
Poles
poles
frequency ranges
Networks (circuits)
pulses

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Kim, Jung Min ; Du, Jin Kyoung ; Kim, Yong Ju ; Kim, Hyungsoo ; Park, Kun Woo ; Kih, Joong Sik ; Yook, Jong Gwan. / Macro-modeling of high-speed digital board to package interconnections. In: IEEE MTT-S International Microwave Symposium Digest. 2006 ; pp. 1959-1962.
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Macro-modeling of high-speed digital board to package interconnections. / Kim, Jung Min; Du, Jin Kyoung; Kim, Yong Ju; Kim, Hyungsoo; Park, Kun Woo; Kih, Joong Sik; Yook, Jong Gwan.

In: IEEE MTT-S International Microwave Symposium Digest, 01.12.2006, p. 1959-1962.

Research output: Contribution to journalConference article

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