An experimental method is presented to measure microthermal deformation of an optical pick-up base by using holographic interferometry. Calibration tests are used to measure out-of-plane and in-plane deformations. A cantilever and a plate are deformed according to the prescribed motion, actuated by a piezoelectric transducer with 1-nm resolution, and the Interferometric measurements are compared quantitatively with the analytic solution and measurements from finite element analysis (FEA). The thermal deformation of an aluminum pick-up base, manufactured from a die-casting process, are measured in actual thermal environments by using the present holographic Interferometry. Finally, the experimental results obtained by using holographic Interferometry are compared with those of the FEA with initial surface stress conditions obtained from x-ray diffraction measurements.
Bibliographical noteFunding Information:
This work was funded by the Korea Science and Engineering Foundation, through the Center for Information Storage Device (2002-2-0145) at Yonsei University, and in part by Samsung Electronics Company, Limited. The authors are also grateful for helpful discussions with Mr. P. Sung at Samsung Electronics.
All Science Journal Classification (ASJC) codes
- Atomic and Molecular Physics, and Optics