The transmission characteristics of wafer-scale interconnection lines, which were modeled by weakly coupled lossy transmission lines, were investigated using the exact solutions of line equations in frequency domain and a modified inverse FFT algorithm. For the driven line terminated in Z//o, interconnection length in wafer-scale integration (WSI) should be less than 15-20 cm to obtain high performance with low coupling. In the case of homogeneous dielectric structure, rise time dependent coupling is suppressed for both the lossless and lossy lines. However, other loss-induced coupling effects, which are not rise time dependent, still cause some far-end noise on lossy lines. Analytical results agreed with measurements.
|Title of host publication||Unknown Host Publication Title|
|Number of pages||9|
|Publication status||Published - 1987|
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