Abstract
Large Flip Chip BGA (FCBGA) packages are needed in high pin out applications (>1800), e.g., ASIC's and are typically used in high reliability and robustness applications. Hence understanding the package reliability and robustness becomes one of paramount importance for efficient product design. There are various aspects to the package that need to be understood, to ensure an effective design. The focus of this paper is to understand the BGA reliability of the package with particular reference to comparison of the surface finish, vis-à-vis, between Electroless Nickel Immersion Gold (ENIG) and Solder On Pad (SOP) on the substrate side of the package, which are the typical solutions for large plastic FC-BGA packages. Tests, which include board level temperature cycling, monotonic bend and shock testing have been conducted to compare the two surface finish options. The results of these tests demonstrate that the mechanical strength of the interface exceeds by a factor of two for the SOP surface finish, while BGA design parameters play a key role in ensuring comparative temperature cycle reliability in comparison with ENIG packages.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging |
| Publisher | American Society of Mechanical Engineers (ASME) |
| ISBN (Print) | 0791837904, 9780791837900 |
| DOIs | |
| Publication status | Published - 2006 Jan 1 |
| Event | 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States Duration: 2006 Nov 5 → 2006 Nov 10 |
Other
| Other | 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 |
|---|---|
| Country | United States |
| City | Chicago, IL |
| Period | 06/11/5 → 06/11/10 |
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All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Electrical and Electronic Engineering
Cite this
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Mechanical and thermal board level reliability comparison between electroless NI IM. AU and solder on PAD surface finishes for large flip chip BGA packages. / Ramakrishna, Gnyaneshwar; Donghyun, Kim; Ahmad, Mudasir; Gopalakrishnan, Lavanya; Mason, Hu; Sue, Teng; Edwards, Bill.
Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME), 2006.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Mechanical and thermal board level reliability comparison between electroless NI IM. AU and solder on PAD surface finishes for large flip chip BGA packages
AU - Ramakrishna, Gnyaneshwar
AU - Donghyun, Kim
AU - Ahmad, Mudasir
AU - Gopalakrishnan, Lavanya
AU - Mason, Hu
AU - Sue, Teng
AU - Edwards, Bill
PY - 2006/1/1
Y1 - 2006/1/1
N2 - Large Flip Chip BGA (FCBGA) packages are needed in high pin out applications (>1800), e.g., ASIC's and are typically used in high reliability and robustness applications. Hence understanding the package reliability and robustness becomes one of paramount importance for efficient product design. There are various aspects to the package that need to be understood, to ensure an effective design. The focus of this paper is to understand the BGA reliability of the package with particular reference to comparison of the surface finish, vis-à-vis, between Electroless Nickel Immersion Gold (ENIG) and Solder On Pad (SOP) on the substrate side of the package, which are the typical solutions for large plastic FC-BGA packages. Tests, which include board level temperature cycling, monotonic bend and shock testing have been conducted to compare the two surface finish options. The results of these tests demonstrate that the mechanical strength of the interface exceeds by a factor of two for the SOP surface finish, while BGA design parameters play a key role in ensuring comparative temperature cycle reliability in comparison with ENIG packages.
AB - Large Flip Chip BGA (FCBGA) packages are needed in high pin out applications (>1800), e.g., ASIC's and are typically used in high reliability and robustness applications. Hence understanding the package reliability and robustness becomes one of paramount importance for efficient product design. There are various aspects to the package that need to be understood, to ensure an effective design. The focus of this paper is to understand the BGA reliability of the package with particular reference to comparison of the surface finish, vis-à-vis, between Electroless Nickel Immersion Gold (ENIG) and Solder On Pad (SOP) on the substrate side of the package, which are the typical solutions for large plastic FC-BGA packages. Tests, which include board level temperature cycling, monotonic bend and shock testing have been conducted to compare the two surface finish options. The results of these tests demonstrate that the mechanical strength of the interface exceeds by a factor of two for the SOP surface finish, while BGA design parameters play a key role in ensuring comparative temperature cycle reliability in comparison with ENIG packages.
UR - http://www.scopus.com/inward/record.url?scp=84920631734&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84920631734&partnerID=8YFLogxK
U2 - 10.1115/IMECE2006-16074
DO - 10.1115/IMECE2006-16074
M3 - Conference contribution
AN - SCOPUS:84920631734
SN - 0791837904
SN - 9780791837900
BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
PB - American Society of Mechanical Engineers (ASME)
ER -