TY - GEN
T1 - Mechanical and thermal board level reliability comparison between electroless NI IM. AU and solder on PAD surface finishes for large flip chip BGA packages
AU - Ramakrishna, Gnyaneshwar
AU - Donghyun, Kim
AU - Ahmad, Mudasir
AU - Gopalakrishnan, Lavanya
AU - Mason, Hu
AU - Sue, Teng
AU - Edwards, Bill
PY - 2006
Y1 - 2006
N2 - Large Flip Chip BGA (FCBGA) packages are needed in high pin out applications (>1800), e.g., ASIC's and are typically used in high reliability and robustness applications. Hence understanding the package reliability and robustness becomes one of paramount importance for efficient product design. There are various aspects to the package that need to be understood, to ensure an effective design. The focus of this paper is to understand the BGA reliability of the package with particular reference to comparison of the surface finish, vis-à-vis, between Electroless Nickel Immersion Gold (ENIG) and Solder On Pad (SOP) on the substrate side of the package, which are the typical solutions for large plastic FC-BGA packages. Tests, which include board level temperature cycling, monotonic bend and shock testing have been conducted to compare the two surface finish options. The results of these tests demonstrate that the mechanical strength of the interface exceeds by a factor of two for the SOP surface finish, while BGA design parameters play a key role in ensuring comparative temperature cycle reliability in comparison with ENIG packages.
AB - Large Flip Chip BGA (FCBGA) packages are needed in high pin out applications (>1800), e.g., ASIC's and are typically used in high reliability and robustness applications. Hence understanding the package reliability and robustness becomes one of paramount importance for efficient product design. There are various aspects to the package that need to be understood, to ensure an effective design. The focus of this paper is to understand the BGA reliability of the package with particular reference to comparison of the surface finish, vis-à-vis, between Electroless Nickel Immersion Gold (ENIG) and Solder On Pad (SOP) on the substrate side of the package, which are the typical solutions for large plastic FC-BGA packages. Tests, which include board level temperature cycling, monotonic bend and shock testing have been conducted to compare the two surface finish options. The results of these tests demonstrate that the mechanical strength of the interface exceeds by a factor of two for the SOP surface finish, while BGA design parameters play a key role in ensuring comparative temperature cycle reliability in comparison with ENIG packages.
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U2 - 10.1115/IMECE2006-16074
DO - 10.1115/IMECE2006-16074
M3 - Conference contribution
AN - SCOPUS:84920631734
SN - 0791837904
SN - 9780791837900
T3 - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
PB - American Society of Mechanical Engineers (ASME)
T2 - 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Y2 - 5 November 2006 through 10 November 2006
ER -