Mechanical and thermal board level reliability comparison between electroless NI IM. AU and solder on PAD surface finishes for large flip chip BGA packages

Gnyaneshwar Ramakrishna, Kim Donghyun, Mudasir Ahmad, Lavanya Gopalakrishnan, Hu Mason, Teng Sue, Bill Edwards

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Large Flip Chip BGA (FCBGA) packages are needed in high pin out applications (>1800), e.g., ASIC's and are typically used in high reliability and robustness applications. Hence understanding the package reliability and robustness becomes one of paramount importance for efficient product design. There are various aspects to the package that need to be understood, to ensure an effective design. The focus of this paper is to understand the BGA reliability of the package with particular reference to comparison of the surface finish, vis-à-vis, between Electroless Nickel Immersion Gold (ENIG) and Solder On Pad (SOP) on the substrate side of the package, which are the typical solutions for large plastic FC-BGA packages. Tests, which include board level temperature cycling, monotonic bend and shock testing have been conducted to compare the two surface finish options. The results of these tests demonstrate that the mechanical strength of the interface exceeds by a factor of two for the SOP surface finish, while BGA design parameters play a key role in ensuring comparative temperature cycle reliability in comparison with ENIG packages.

Original languageEnglish
Title of host publicationProceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)0791837904, 9780791837900
DOIs
Publication statusPublished - 2006
Event2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States
Duration: 2006 Nov 52006 Nov 10

Publication series

NameAmerican Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
ISSN (Print)1071-6947

Other

Other2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
CountryUnited States
CityChicago, IL
Period06/11/506/11/10

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Ramakrishna, G., Donghyun, K., Ahmad, M., Gopalakrishnan, L., Mason, H., Sue, T., & Edwards, B. (2006). Mechanical and thermal board level reliability comparison between electroless NI IM. AU and solder on PAD surface finishes for large flip chip BGA packages. In Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2006-16074