Mechanical and thermal board level reliability comparison between electroless NI IM. AU and solder on PAD surface finishes for large flip chip BGA packages

Gnyaneshwar Ramakrishna, Kim Donghyun, Mudasir Ahmad, Lavanya Gopalakrishnan, Hu Mason, Teng Sue, Bill Edwards

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Engineering & Materials Science