Metal nanodot array fabrication using self-assembled diblock copolymer

S. J. Kim, W. J. Maeng, D. H. Park, B. H. Sohn, H. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

By combining PS-PMMA self-assembled diblock copolymer (BC) and lift off process, gold nanodot array was fabricated. For surface neutralization, a novel method using conventional self assembled monolayer (SAM), MPTS (3-(p-methoxyphenyl)propyltrichlro-silane) was used. Surface treatment with SAM was analyzed by contact angle measurement and XPS. Upon the fabricated cylindrical nanohole array, gold was evaporated and 10 nm size gold nanoparticle array was fabricated by lift-off process.

Original languageEnglish
Title of host publication2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
Pages488-489
Number of pages2
DOIs
Publication statusPublished - 2006
Event2006 IEEE Nanotechnology Materials and Devices Conference, NMDC - Gyeongju, Korea, Republic of
Duration: 2006 Oct 222006 Oct 25

Publication series

Name2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
Volume1

Other

Other2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
CountryKorea, Republic of
CityGyeongju
Period06/10/2206/10/25

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

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  • Cite this

    Kim, S. J., Maeng, W. J., Park, D. H., Sohn, B. H., & Kim, H. (2006). Metal nanodot array fabrication using self-assembled diblock copolymer. In 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC (pp. 488-489). [4388830] (2006 IEEE Nanotechnology Materials and Devices Conference, NMDC; Vol. 1). https://doi.org/10.1109/NMDC.2006.4388830