Micro line conductor structuring using electro-hydrodynamic printing of silver nano suspension

Dae Young Lee, Eun Soo Hwang, Yong Jun Kim, Jungho Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The generation of fine relics of metallic materials from precursor suspensions is of significant current interest as it holds the key to the fabrication of display and printed circuit board. Some novel printing methods of depositing metallic particles have been suggested in recent years. When a nanoparticle suspension is supplied to a nozzle at a low flow rate and when the interface between air and the liquid is charged to a sufficiently high electrical potential, the liquid meniscus takes the form of a stable cone, whose apex emits a microscopic jet. This is called as cone-jet mode. In our experiments, two silver nanoparticle (3-7 nm, below 25 nm) suspensions flowing through a nozzle were subjected to electro-hydrodynamic printing in the cone-jet mode. The patterns deposited on polyimide film were subsequently post-processed to allow for complete evaporation of the carrier and for curing of the nanoparticles. The properties (feature size, thickness, resistance) of patterned silver line were as measured by surface profiler, confocal laser scanning microscope, and I-V meter. Pattern after post process exhibited feature as fine as 20 μm wide and 0.29 μm thick with resistivity of 13 μΩcm.

Original languageEnglish
Title of host publicationProceedings - 2005 International Symposium on Microelectronics, IMAPS 2005
Pages625-631
Number of pages7
Publication statusPublished - 2005 Dec 1
Event38th International Symposium on Microelectronics, IMAPS 2005 - Philadelphia, PA, United States
Duration: 2005 Sep 252005 Sep 29

Publication series

NameProceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Other

Other38th International Symposium on Microelectronics, IMAPS 2005
CountryUnited States
CityPhiladelphia, PA
Period05/9/2505/9/29

Fingerprint

Cones
Printing
Silver
Hydrodynamics
Nanoparticles
Nozzles
Liquids
Polyimides
Printed circuit boards
Curing
Evaporation
Microscopes
Display devices
Flow rate
Scanning
Fabrication
Lasers
Air
Experiments

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Lee, D. Y., Hwang, E. S., Kim, Y. J., & Hwang, J. (2005). Micro line conductor structuring using electro-hydrodynamic printing of silver nano suspension. In Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005 (pp. 625-631). (Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005).
Lee, Dae Young ; Hwang, Eun Soo ; Kim, Yong Jun ; Hwang, Jungho. / Micro line conductor structuring using electro-hydrodynamic printing of silver nano suspension. Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. pp. 625-631 (Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005).
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Lee, DY, Hwang, ES, Kim, YJ & Hwang, J 2005, Micro line conductor structuring using electro-hydrodynamic printing of silver nano suspension. in Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005, pp. 625-631, 38th International Symposium on Microelectronics, IMAPS 2005, Philadelphia, PA, United States, 05/9/25.

Micro line conductor structuring using electro-hydrodynamic printing of silver nano suspension. / Lee, Dae Young; Hwang, Eun Soo; Kim, Yong Jun; Hwang, Jungho.

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. p. 625-631 (Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lee DY, Hwang ES, Kim YJ, Hwang J. Micro line conductor structuring using electro-hydrodynamic printing of silver nano suspension. In Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. p. 625-631. (Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005).