TY - GEN
T1 - Micro-tribological characteristics of PFPE Zdol lubricant coated on silicon
AU - Kim, Yong Sik
AU - Chung, Koo Hyun
AU - Kim, Dae Eun
PY - 2004/1/1
Y1 - 2004/1/1
N2 - The reliability problem is crucial in micro-systems. In order to increase the reliability and durability, new lubrication is needed since conventional lubricant cannot be used in the micro-system. In this work, the fundamental tribological characteristics of perfluoropolyether (PFPE) Fomblin Zdol lubricants with different thickness coated on silicon by dip coating method were investigated. The Zdol lubricant was characterized by ellipsometry, contact angle measurement, X-ray Photoelectron Spectroscopy (XPS), and Atomic Force Microscope (AFM). Especially, characteristics of unbonded Zdol films were compared with that of bonded Zdol films from the view point of stiction and friction. As a result, optimum thickness of unbonded as well as bonded Zdol film was proposed. Also, it was found that the Zdol films with only bonded fraction had lower stiction/friction coefficient than the Zdol film with unbonded and bonded fraction.
AB - The reliability problem is crucial in micro-systems. In order to increase the reliability and durability, new lubrication is needed since conventional lubricant cannot be used in the micro-system. In this work, the fundamental tribological characteristics of perfluoropolyether (PFPE) Fomblin Zdol lubricants with different thickness coated on silicon by dip coating method were investigated. The Zdol lubricant was characterized by ellipsometry, contact angle measurement, X-ray Photoelectron Spectroscopy (XPS), and Atomic Force Microscope (AFM). Especially, characteristics of unbonded Zdol films were compared with that of bonded Zdol films from the view point of stiction and friction. As a result, optimum thickness of unbonded as well as bonded Zdol film was proposed. Also, it was found that the Zdol films with only bonded fraction had lower stiction/friction coefficient than the Zdol film with unbonded and bonded fraction.
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U2 - 10.1109/APMRC.2004.1521967
DO - 10.1109/APMRC.2004.1521967
M3 - Conference contribution
AN - SCOPUS:84934284269
T3 - Asia-Pacific Magnetic Recording Conference 2004, Digest of APMRC 2004
SP - 93
EP - 94
BT - Asia-Pacific Magnetic Recording Conference 2004, Digest of APMRC 2004
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2004 Asia-Pacific Magnetic Recording Conference, APMRC 2004
Y2 - 16 August 2004 through 19 August 2004
ER -