Microcrystalline oxide-incorporated new diffusion barrier for dynamic random access memory and ferroelectric random access memory capacitor electrode

Dong Soo Yoon, Hong Koo Baik, Sung Man Lee

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Microcrystalline oxide-incorporated new diffusion barrier for dynamic random access memory (DRAM) and ferroelectric random access memory (FRAM) capacitor electrodes is proposed. The thermal stability of the Pt/Ta+CeO2/TiSi2/poly-Si/SiO2/Si contact system is investigated and is compared to that of the Pt/Ta/TiSi2/poly-Si/SiO2/Si contact system. The Pt/Ta+CeO2/TiSi2/poly-Si/SiO2/Si contact system retained its structures up to 800°C without increase in electrical resistivity but the Pt/Ta/TiSi2/poly-Si/SiO2/Si contact system was completely degraded after annealing at 650°C. In the former case, since the addition of cerium dioxide (CeO2) led to the stuffing of microcrystalline oxide along the grain boundaries in Ta matrix and CeO2 was much heavier atomic weight than any stuffed elements, it prevented the interdiffusion of O, Pt, and Si through grain boundaries which can act as fast diffusion paths to high temperatures. It appears that the barrier properties of the microcrystalline oxide-incorporated new diffusion barrier are superior to polycrystalline transition metal barriers, polycrystalline nitride barriers, ternary amorphous compound barriers, and N2- and O2-stuffed barriers.

Original languageEnglish
Pages (from-to)2781-2786
Number of pages6
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume15
Issue number5
DOIs
Publication statusPublished - 1997 Jan 1

Fingerprint

Diffusion barriers
random access memory
Polysilicon
Oxides
Ferroelectric materials
capacitors
Capacitors
Data storage equipment
Electrodes
electrodes
oxides
electric contacts
Grain boundaries
Interdiffusion (solids)
Cerium
Nitrides
Transition metals
grain boundaries
Thermodynamic stability
Annealing

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

Cite this

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abstract = "Microcrystalline oxide-incorporated new diffusion barrier for dynamic random access memory (DRAM) and ferroelectric random access memory (FRAM) capacitor electrodes is proposed. The thermal stability of the Pt/Ta+CeO2/TiSi2/poly-Si/SiO2/Si contact system is investigated and is compared to that of the Pt/Ta/TiSi2/poly-Si/SiO2/Si contact system. The Pt/Ta+CeO2/TiSi2/poly-Si/SiO2/Si contact system retained its structures up to 800°C without increase in electrical resistivity but the Pt/Ta/TiSi2/poly-Si/SiO2/Si contact system was completely degraded after annealing at 650°C. In the former case, since the addition of cerium dioxide (CeO2) led to the stuffing of microcrystalline oxide along the grain boundaries in Ta matrix and CeO2 was much heavier atomic weight than any stuffed elements, it prevented the interdiffusion of O, Pt, and Si through grain boundaries which can act as fast diffusion paths to high temperatures. It appears that the barrier properties of the microcrystalline oxide-incorporated new diffusion barrier are superior to polycrystalline transition metal barriers, polycrystalline nitride barriers, ternary amorphous compound barriers, and N2- and O2-stuffed barriers.",
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AU - Baik, Hong Koo

AU - Lee, Sung Man

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AB - Microcrystalline oxide-incorporated new diffusion barrier for dynamic random access memory (DRAM) and ferroelectric random access memory (FRAM) capacitor electrodes is proposed. The thermal stability of the Pt/Ta+CeO2/TiSi2/poly-Si/SiO2/Si contact system is investigated and is compared to that of the Pt/Ta/TiSi2/poly-Si/SiO2/Si contact system. The Pt/Ta+CeO2/TiSi2/poly-Si/SiO2/Si contact system retained its structures up to 800°C without increase in electrical resistivity but the Pt/Ta/TiSi2/poly-Si/SiO2/Si contact system was completely degraded after annealing at 650°C. In the former case, since the addition of cerium dioxide (CeO2) led to the stuffing of microcrystalline oxide along the grain boundaries in Ta matrix and CeO2 was much heavier atomic weight than any stuffed elements, it prevented the interdiffusion of O, Pt, and Si through grain boundaries which can act as fast diffusion paths to high temperatures. It appears that the barrier properties of the microcrystalline oxide-incorporated new diffusion barrier are superior to polycrystalline transition metal barriers, polycrystalline nitride barriers, ternary amorphous compound barriers, and N2- and O2-stuffed barriers.

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