Microstructural modulations enhance the mechanical properties in Al-Cu-(Si, Ga) ultrafine composites

Jin Man Park, Simon Pauly, Norbert Mattern, Do Hyang Kim, Ki Buem Kim, Jürgen Eckert

Research output: Contribution to journalArticle

10 Citations (Scopus)


Adding small amounts of Si or Ga (3 at.%) to the eutectic Al 83Cu17 alloy yields an ultrafine bimodal eutectic composite microstructure upon solidification. The as-solidified alloys exhibit a distinct microstructural length-scale hierarchy leading to a high fracture strength of around 1 GPa combined with a large compressive plastic strain of up to 30% at room temperature. The present results suggest that the mechanical properties of the ultrafine bimodal eutectic composites are strongly related to their microstructural characteristics, namely phase evolution, length-scales, and distribution of the constituent phases.

Original languageEnglish
Pages (from-to)1137-1141
Number of pages5
JournalAdvanced Engineering Materials
Issue number11
Publication statusPublished - 2010 Nov 1


All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

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