Abstract
We show that highly conductive Cu films are obtainable from Cu complex ink by laser sintering. The Cu inks, synthesized using Cu formate as a precursor, were spin-coated onto polyimide substrate and scanned by an ultraviolet laser at 355 nm. The blowing of N 2 gas into the irradiated area prevented the film from being oxidized and a minimum resistivity of 1.70 × 10 -5 Ω cm was obtained. The laser-sintered film, composed mainly of nanorods, exhibited a much tighter structure than the one achieved by the typical thermal process. Although the thermal-sintered Cu film had a better crystalline quality, the minimum resistivity values available with both methods were almost identical. This is attributed to the more compact microstructure induced by laser sintering.
Original language | English |
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Pages (from-to) | 42-45 |
Number of pages | 4 |
Journal | Applied Surface Science |
Volume | 307 |
DOIs | |
Publication status | Published - 2014 Jul 15 |
All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Surfaces and Interfaces
- Surfaces, Coatings and Films