TY - GEN
T1 - Microswitch with self-assembled carbon nanotube arrays for high current density and reliable contact
AU - Choi, Jungwook
AU - Lee, Jae Ik
AU - Eun, Youngkee
AU - Kim, Min Ook
AU - Kim, Jongbaeg
PY - 2011
Y1 - 2011
N2 - A microswitch based on self-assembled carbon nanotube (CNT) arrays as micromechanical contact material has been demonstrated. The aligned CNT arrays are synthesized on microelectrodes and movable shuttle fabricated on a silicon-on-insulator (SOI) wafer. The CNT arrays are self-assembled on microstructures making mechanical contact between source and shuttle, and this contact is preloaded by the growth force of CNT and mechanical restoring force of the strained springs. Based on high interfacial contact area of CNT arrays, high electrical conductivity and excellent mechanical properties of CNT, highly reliable and durable micromechanical contact for microswitch is experimentally demonstrated while high-density currents are stably transmitted.
AB - A microswitch based on self-assembled carbon nanotube (CNT) arrays as micromechanical contact material has been demonstrated. The aligned CNT arrays are synthesized on microelectrodes and movable shuttle fabricated on a silicon-on-insulator (SOI) wafer. The CNT arrays are self-assembled on microstructures making mechanical contact between source and shuttle, and this contact is preloaded by the growth force of CNT and mechanical restoring force of the strained springs. Based on high interfacial contact area of CNT arrays, high electrical conductivity and excellent mechanical properties of CNT, highly reliable and durable micromechanical contact for microswitch is experimentally demonstrated while high-density currents are stably transmitted.
UR - http://www.scopus.com/inward/record.url?scp=79953767827&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2011.5734368
DO - 10.1109/MEMSYS.2011.5734368
M3 - Conference contribution
AN - SCOPUS:79953767827
SN - 9781424496327
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 87
EP - 90
BT - 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Y2 - 23 January 2011 through 27 January 2011
ER -