Modeling and analysis of electromagnetic bandgap structures on power distribution network

Sang Gyu Kim, Hyun Kim, Hee Do Kang, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Transmission line method (TLM) is applied for analysis of a conventional electromagnetic bandgap (EBG) structure with arbitrary shaped power/ground plane. The fast and accurate modeling by TLM shows the computationally efficient results with respect to full-wave electromagnetic analysis. Moreover it is shown that suppression bandwidth of a EBG structure can be easily analyzed by stepped impedance filter and the calculated bandwidth is identical to the measured.

Original languageEnglish
Title of host publication2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China
Duration: 2009 Dec 22009 Dec 4

Publication series

Name2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Other

Other2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
CountryChina
CityShatin, Hong Kong
Period09/12/209/12/4

Fingerprint

Electric power distribution
Electric lines
Energy gap
Bandwidth
Electromagnetic waves

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kim, S. G., Kim, H., Kang, H. D., & Yook, J. G. (2009). Modeling and analysis of electromagnetic bandgap structures on power distribution network. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 [5403992] (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009). https://doi.org/10.1109/EDAPS.2009.5403992
Kim, Sang Gyu ; Kim, Hyun ; Kang, Hee Do ; Yook, Jong Gwan. / Modeling and analysis of electromagnetic bandgap structures on power distribution network. 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009).
@inproceedings{389e3d17e170472886bf2284e8b04de0,
title = "Modeling and analysis of electromagnetic bandgap structures on power distribution network",
abstract = "Transmission line method (TLM) is applied for analysis of a conventional electromagnetic bandgap (EBG) structure with arbitrary shaped power/ground plane. The fast and accurate modeling by TLM shows the computationally efficient results with respect to full-wave electromagnetic analysis. Moreover it is shown that suppression bandwidth of a EBG structure can be easily analyzed by stepped impedance filter and the calculated bandwidth is identical to the measured.",
author = "Kim, {Sang Gyu} and Hyun Kim and Kang, {Hee Do} and Yook, {Jong Gwan}",
year = "2009",
month = "12",
day = "1",
doi = "10.1109/EDAPS.2009.5403992",
language = "English",
isbn = "9781424453504",
series = "2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009",
booktitle = "2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009",

}

Kim, SG, Kim, H, Kang, HD & Yook, JG 2009, Modeling and analysis of electromagnetic bandgap structures on power distribution network. in 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009., 5403992, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, Shatin, Hong Kong, China, 09/12/2. https://doi.org/10.1109/EDAPS.2009.5403992

Modeling and analysis of electromagnetic bandgap structures on power distribution network. / Kim, Sang Gyu; Kim, Hyun; Kang, Hee Do; Yook, Jong Gwan.

2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403992 (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Modeling and analysis of electromagnetic bandgap structures on power distribution network

AU - Kim, Sang Gyu

AU - Kim, Hyun

AU - Kang, Hee Do

AU - Yook, Jong Gwan

PY - 2009/12/1

Y1 - 2009/12/1

N2 - Transmission line method (TLM) is applied for analysis of a conventional electromagnetic bandgap (EBG) structure with arbitrary shaped power/ground plane. The fast and accurate modeling by TLM shows the computationally efficient results with respect to full-wave electromagnetic analysis. Moreover it is shown that suppression bandwidth of a EBG structure can be easily analyzed by stepped impedance filter and the calculated bandwidth is identical to the measured.

AB - Transmission line method (TLM) is applied for analysis of a conventional electromagnetic bandgap (EBG) structure with arbitrary shaped power/ground plane. The fast and accurate modeling by TLM shows the computationally efficient results with respect to full-wave electromagnetic analysis. Moreover it is shown that suppression bandwidth of a EBG structure can be easily analyzed by stepped impedance filter and the calculated bandwidth is identical to the measured.

UR - http://www.scopus.com/inward/record.url?scp=77950294360&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950294360&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2009.5403992

DO - 10.1109/EDAPS.2009.5403992

M3 - Conference contribution

AN - SCOPUS:77950294360

SN - 9781424453504

T3 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

BT - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

ER -

Kim SG, Kim H, Kang HD, Yook JG. Modeling and analysis of electromagnetic bandgap structures on power distribution network. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5403992. (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009). https://doi.org/10.1109/EDAPS.2009.5403992