Modeling of ESD and EMI problems in split multi-layer power distribution network

Hwang Yoon Shim, Jiseong Kim, Jong Gwan Yook

Research output: Contribution to journalConference article

11 Citations (Scopus)

Abstract

ESD and EMI problems and their possible solutions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split I/O port ground with stitching element such as conductor or inductor is proposed, while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.

Original languageEnglish
Pages (from-to)48-51
Number of pages4
JournalIEEE International Symposium on Electromagnetic Compatibility
Volume1
Publication statusPublished - 2003 Oct 20
Event2003 IEEE Symposium on Electromagnetic Compatibility - Boston, MA, United States
Duration: 2003 Aug 182003 Aug 22

Fingerprint

digital systems
Finite difference time domain method
inductors
Electric power distribution
finite difference time domain method
Electromagnetic waves
decoupling
capacitors
electromagnetic radiation
Capacitors
conductors
high speed
damage
simulation

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

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abstract = "ESD and EMI problems and their possible solutions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split I/O port ground with stitching element such as conductor or inductor is proposed, while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.",
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Modeling of ESD and EMI problems in split multi-layer power distribution network. / Shim, Hwang Yoon; Kim, Jiseong; Yook, Jong Gwan.

In: IEEE International Symposium on Electromagnetic Compatibility, Vol. 1, 20.10.2003, p. 48-51.

Research output: Contribution to journalConference article

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AU - Shim, Hwang Yoon

AU - Kim, Jiseong

AU - Yook, Jong Gwan

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N2 - ESD and EMI problems and their possible solutions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split I/O port ground with stitching element such as conductor or inductor is proposed, while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.

AB - ESD and EMI problems and their possible solutions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split I/O port ground with stitching element such as conductor or inductor is proposed, while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.

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