Modeling of ESD and EMI problems in split multi-layer power distribution network

Hwang Yoon Shim, Jiseong Kim, Jong Gwan Yook

Research output: Contribution to journalConference articlepeer-review

12 Citations (Scopus)


ESD and EMI problems and their possible solutions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split I/O port ground with stitching element such as conductor or inductor is proposed, while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.

Original languageEnglish
Pages (from-to)48-51
Number of pages4
JournalIEEE International Symposium on Electromagnetic Compatibility
Publication statusPublished - 2003
Event2003 IEEE Symposium on Electromagnetic Compatibility - Boston, MA, United States
Duration: 2003 Aug 182003 Aug 22

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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