Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)

Jun Bo Yoon, Chul Hi Han, Euisik Yoon, Choong Ki Kim

Research output: Contribution to conferencePaper

17 Citations (Scopus)

Abstract

A new monolithic integration method for 3-D electroplated microstructures of unlimited number of levels has been developed using unique planarization with a sacrificial metallic mold (PSMM). Contrary to the conventional electroplating mold of photoresist or polyimide, the sacrificial metallic mold (SMM) is used for multiple functions: a sacrificial layer, a planarization layer, and a seed layer for the next-level electroplating as well. We have successfully demonstrated various three-level metallic microstructures, such as levitated on-chip inductors, micro-bridges, micro-cantilevers, and micro-mirrors. The RF performance of the fabricated inductor has shown excellent results of 5 nH, Q-factor of 50 at 5 GHz on glass. This method is very simple, highly adaptable, and IC-compatible, so that it can be used as a versatile tool to integrate various 3-D metallic microstructures in multiple levels.

Original languageEnglish
Pages624-629
Number of pages6
Publication statusPublished - 1999 Jan 1
EventProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA
Duration: 1999 Jan 171999 Jan 21

Conference

ConferenceProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS
CityOrlando, FL, USA
Period99/1/1799/1/21

Fingerprint

Electroplating
Microstructure
Photoresists
Polyimides
Seed
Mirrors
Glass

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Yoon, J. B., Han, C. H., Yoon, E., & Kim, C. K. (1999). Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM). 624-629. Paper presented at Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, Orlando, FL, USA, .
Yoon, Jun Bo ; Han, Chul Hi ; Yoon, Euisik ; Kim, Choong Ki. / Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM). Paper presented at Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, Orlando, FL, USA, .6 p.
@conference{aa8beb38890b4e908b42eae3948f5e3f,
title = "Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)",
abstract = "A new monolithic integration method for 3-D electroplated microstructures of unlimited number of levels has been developed using unique planarization with a sacrificial metallic mold (PSMM). Contrary to the conventional electroplating mold of photoresist or polyimide, the sacrificial metallic mold (SMM) is used for multiple functions: a sacrificial layer, a planarization layer, and a seed layer for the next-level electroplating as well. We have successfully demonstrated various three-level metallic microstructures, such as levitated on-chip inductors, micro-bridges, micro-cantilevers, and micro-mirrors. The RF performance of the fabricated inductor has shown excellent results of 5 nH, Q-factor of 50 at 5 GHz on glass. This method is very simple, highly adaptable, and IC-compatible, so that it can be used as a versatile tool to integrate various 3-D metallic microstructures in multiple levels.",
author = "Yoon, {Jun Bo} and Han, {Chul Hi} and Euisik Yoon and Kim, {Choong Ki}",
year = "1999",
month = "1",
day = "1",
language = "English",
pages = "624--629",
note = "Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS ; Conference date: 17-01-1999 Through 21-01-1999",

}

Yoon, JB, Han, CH, Yoon, E & Kim, CK 1999, 'Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)', Paper presented at Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, Orlando, FL, USA, 99/1/17 - 99/1/21 pp. 624-629.

Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM). / Yoon, Jun Bo; Han, Chul Hi; Yoon, Euisik; Kim, Choong Ki.

1999. 624-629 Paper presented at Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, Orlando, FL, USA, .

Research output: Contribution to conferencePaper

TY - CONF

T1 - Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)

AU - Yoon, Jun Bo

AU - Han, Chul Hi

AU - Yoon, Euisik

AU - Kim, Choong Ki

PY - 1999/1/1

Y1 - 1999/1/1

N2 - A new monolithic integration method for 3-D electroplated microstructures of unlimited number of levels has been developed using unique planarization with a sacrificial metallic mold (PSMM). Contrary to the conventional electroplating mold of photoresist or polyimide, the sacrificial metallic mold (SMM) is used for multiple functions: a sacrificial layer, a planarization layer, and a seed layer for the next-level electroplating as well. We have successfully demonstrated various three-level metallic microstructures, such as levitated on-chip inductors, micro-bridges, micro-cantilevers, and micro-mirrors. The RF performance of the fabricated inductor has shown excellent results of 5 nH, Q-factor of 50 at 5 GHz on glass. This method is very simple, highly adaptable, and IC-compatible, so that it can be used as a versatile tool to integrate various 3-D metallic microstructures in multiple levels.

AB - A new monolithic integration method for 3-D electroplated microstructures of unlimited number of levels has been developed using unique planarization with a sacrificial metallic mold (PSMM). Contrary to the conventional electroplating mold of photoresist or polyimide, the sacrificial metallic mold (SMM) is used for multiple functions: a sacrificial layer, a planarization layer, and a seed layer for the next-level electroplating as well. We have successfully demonstrated various three-level metallic microstructures, such as levitated on-chip inductors, micro-bridges, micro-cantilevers, and micro-mirrors. The RF performance of the fabricated inductor has shown excellent results of 5 nH, Q-factor of 50 at 5 GHz on glass. This method is very simple, highly adaptable, and IC-compatible, so that it can be used as a versatile tool to integrate various 3-D metallic microstructures in multiple levels.

UR - http://www.scopus.com/inward/record.url?scp=0032675869&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032675869&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0032675869

SP - 624

EP - 629

ER -

Yoon JB, Han CH, Yoon E, Kim CK. Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM). 1999. Paper presented at Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, Orlando, FL, USA, .