Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)

Jun Bo Yoon, Chul Hi Han, Euisik Yoon, Choong Ki Kim

Research output: Contribution to conferencePaper

17 Citations (Scopus)

Abstract

A new monolithic integration method for 3-D electroplated microstructures of unlimited number of levels has been developed using unique planarization with a sacrificial metallic mold (PSMM). Contrary to the conventional electroplating mold of photoresist or polyimide, the sacrificial metallic mold (SMM) is used for multiple functions: a sacrificial layer, a planarization layer, and a seed layer for the next-level electroplating as well. We have successfully demonstrated various three-level metallic microstructures, such as levitated on-chip inductors, micro-bridges, micro-cantilevers, and micro-mirrors. The RF performance of the fabricated inductor has shown excellent results of 5 nH, Q-factor of 50 at 5 GHz on glass. This method is very simple, highly adaptable, and IC-compatible, so that it can be used as a versatile tool to integrate various 3-D metallic microstructures in multiple levels.

Original languageEnglish
Pages624-629
Number of pages6
Publication statusPublished - 1999 Jan 1
EventProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA
Duration: 1999 Jan 171999 Jan 21

Conference

ConferenceProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS
CityOrlando, FL, USA
Period99/1/1799/1/21

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Yoon, J. B., Han, C. H., Yoon, E., & Kim, C. K. (1999). Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM). 624-629. Paper presented at Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, Orlando, FL, USA, .