Multi-jet atmospheric glow plasma cleaning of ablation debris from micro-via drilling process

Eung Suok Lee, Hae Il Park, Hong Koo Baik, Se Jong Lee, Kie Moon Song, Myung Keun Hwang, Chang Su Huh

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

We devised a multi-jet atmospheric glow plasma system and successfully verified a possibility to ignite and maintain an atmospheric pressure discharge using helium, argon or a mixture of helium and oxygen gas. In this study, as an alternative method to the conventional wet cleaning process, the multi-jet atmospheric glow plasma system was applied to clean the ablation debris inside the blind via holes from micro-via drilling process of printed circuit boards (PCBs) prior to electroplating process. Scanning electron microscope images, after the multi-jet atmospheric glow plasma treatment of the PCBs, showed effective removal of residual organic impurities and massive fibrous debris when compared with low-pressure vacuum plasma treatment. Consequently, we demonstrated that multi-jet atmospheric glow plasma system could not only effectively remove organic impurities and massive fibrous debris generated during micro-via drilling process, but also enhance the electroplating process and the wire bondability.

Original languageEnglish
Pages (from-to)307-311
Number of pages5
JournalSurface and Coatings Technology
Volume171
Issue number1-3
DOIs
Publication statusPublished - 2003 Jul 1

Fingerprint

Ablation
drilling
debris
Debris
cleaning
ablation
Cleaning
Drilling
luminescence
Plasmas
Helium
electroplating
printed circuits
circuit boards
Electroplating
Printed circuit boards
helium
Impurities
impurities
Argon

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Lee, Eung Suok ; Park, Hae Il ; Baik, Hong Koo ; Lee, Se Jong ; Song, Kie Moon ; Hwang, Myung Keun ; Huh, Chang Su. / Multi-jet atmospheric glow plasma cleaning of ablation debris from micro-via drilling process. In: Surface and Coatings Technology. 2003 ; Vol. 171, No. 1-3. pp. 307-311.
@article{7537f4c8086d4b699b5baae18e0bb615,
title = "Multi-jet atmospheric glow plasma cleaning of ablation debris from micro-via drilling process",
abstract = "We devised a multi-jet atmospheric glow plasma system and successfully verified a possibility to ignite and maintain an atmospheric pressure discharge using helium, argon or a mixture of helium and oxygen gas. In this study, as an alternative method to the conventional wet cleaning process, the multi-jet atmospheric glow plasma system was applied to clean the ablation debris inside the blind via holes from micro-via drilling process of printed circuit boards (PCBs) prior to electroplating process. Scanning electron microscope images, after the multi-jet atmospheric glow plasma treatment of the PCBs, showed effective removal of residual organic impurities and massive fibrous debris when compared with low-pressure vacuum plasma treatment. Consequently, we demonstrated that multi-jet atmospheric glow plasma system could not only effectively remove organic impurities and massive fibrous debris generated during micro-via drilling process, but also enhance the electroplating process and the wire bondability.",
author = "Lee, {Eung Suok} and Park, {Hae Il} and Baik, {Hong Koo} and Lee, {Se Jong} and Song, {Kie Moon} and Hwang, {Myung Keun} and Huh, {Chang Su}",
year = "2003",
month = "7",
day = "1",
doi = "10.1016/S0257-8972(03)00291-3",
language = "English",
volume = "171",
pages = "307--311",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",
number = "1-3",

}

Multi-jet atmospheric glow plasma cleaning of ablation debris from micro-via drilling process. / Lee, Eung Suok; Park, Hae Il; Baik, Hong Koo; Lee, Se Jong; Song, Kie Moon; Hwang, Myung Keun; Huh, Chang Su.

In: Surface and Coatings Technology, Vol. 171, No. 1-3, 01.07.2003, p. 307-311.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Multi-jet atmospheric glow plasma cleaning of ablation debris from micro-via drilling process

AU - Lee, Eung Suok

AU - Park, Hae Il

AU - Baik, Hong Koo

AU - Lee, Se Jong

AU - Song, Kie Moon

AU - Hwang, Myung Keun

AU - Huh, Chang Su

PY - 2003/7/1

Y1 - 2003/7/1

N2 - We devised a multi-jet atmospheric glow plasma system and successfully verified a possibility to ignite and maintain an atmospheric pressure discharge using helium, argon or a mixture of helium and oxygen gas. In this study, as an alternative method to the conventional wet cleaning process, the multi-jet atmospheric glow plasma system was applied to clean the ablation debris inside the blind via holes from micro-via drilling process of printed circuit boards (PCBs) prior to electroplating process. Scanning electron microscope images, after the multi-jet atmospheric glow plasma treatment of the PCBs, showed effective removal of residual organic impurities and massive fibrous debris when compared with low-pressure vacuum plasma treatment. Consequently, we demonstrated that multi-jet atmospheric glow plasma system could not only effectively remove organic impurities and massive fibrous debris generated during micro-via drilling process, but also enhance the electroplating process and the wire bondability.

AB - We devised a multi-jet atmospheric glow plasma system and successfully verified a possibility to ignite and maintain an atmospheric pressure discharge using helium, argon or a mixture of helium and oxygen gas. In this study, as an alternative method to the conventional wet cleaning process, the multi-jet atmospheric glow plasma system was applied to clean the ablation debris inside the blind via holes from micro-via drilling process of printed circuit boards (PCBs) prior to electroplating process. Scanning electron microscope images, after the multi-jet atmospheric glow plasma treatment of the PCBs, showed effective removal of residual organic impurities and massive fibrous debris when compared with low-pressure vacuum plasma treatment. Consequently, we demonstrated that multi-jet atmospheric glow plasma system could not only effectively remove organic impurities and massive fibrous debris generated during micro-via drilling process, but also enhance the electroplating process and the wire bondability.

UR - http://www.scopus.com/inward/record.url?scp=0038721080&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038721080&partnerID=8YFLogxK

U2 - 10.1016/S0257-8972(03)00291-3

DO - 10.1016/S0257-8972(03)00291-3

M3 - Article

AN - SCOPUS:0038721080

VL - 171

SP - 307

EP - 311

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

IS - 1-3

ER -