Multi-objective production scheduling of probe process in semiconductor manufacturing

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Semiconductor products are manufactured through the process of wafer fabrication, probe or electrical die sorting, assembly and final test. In particular, in this study we deal with the wafer probe process which requires several types of equipment with different capacities. As a connecting procedure of the fabrication and the assembly, the probe process may determine the capacity of whole semiconductor manufacturing. The throughput needs to be maximized as for most manufacturing lines. Because of unexpected machine failure and planned preventive maintenance, the utilization of machines has to be kept at a certain range for stabilizing the process. Hence, the production progress for each device and the utilization of machines are objectives to be maximized simultaneously, while both tend to work in opposite directions because of changeover time loss. Heuristic algorithms are developed and computationally tested. LP-based heuristic gives satisfactory results, especially for the manufacturing line with high diversity in types of machine and device.

Original languageEnglish
Pages (from-to)660-669
Number of pages10
JournalProduction Planning and Control
Volume11
Issue number7
DOIs
Publication statusPublished - 2000 Oct 1

Fingerprint

Scheduling
Semiconductor materials
Fabrication
Preventive maintenance
Heuristic algorithms
Sorting
Throughput
Semiconductor manufacturing
Production/scheduling
Manufacturing

All Science Journal Classification (ASJC) codes

  • Management Science and Operations Research
  • Industrial and Manufacturing Engineering

Cite this

@article{a5891853e3574967842e4b7e2502d15c,
title = "Multi-objective production scheduling of probe process in semiconductor manufacturing",
abstract = "Semiconductor products are manufactured through the process of wafer fabrication, probe or electrical die sorting, assembly and final test. In particular, in this study we deal with the wafer probe process which requires several types of equipment with different capacities. As a connecting procedure of the fabrication and the assembly, the probe process may determine the capacity of whole semiconductor manufacturing. The throughput needs to be maximized as for most manufacturing lines. Because of unexpected machine failure and planned preventive maintenance, the utilization of machines has to be kept at a certain range for stabilizing the process. Hence, the production progress for each device and the utilization of machines are objectives to be maximized simultaneously, while both tend to work in opposite directions because of changeover time loss. Heuristic algorithms are developed and computationally tested. LP-based heuristic gives satisfactory results, especially for the manufacturing line with high diversity in types of machine and device.",
author = "Lee, {Young Hoon} and Lee, {Byung Ki} and Jeong, {Bong Ju}",
year = "2000",
month = "10",
day = "1",
doi = "10.1080/095372800432124",
language = "English",
volume = "11",
pages = "660--669",
journal = "Production Planning and Control",
issn = "0953-7287",
publisher = "Taylor and Francis Ltd.",
number = "7",

}

Multi-objective production scheduling of probe process in semiconductor manufacturing. / Lee, Young Hoon; Lee, Byung Ki; Jeong, Bong Ju.

In: Production Planning and Control, Vol. 11, No. 7, 01.10.2000, p. 660-669.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Multi-objective production scheduling of probe process in semiconductor manufacturing

AU - Lee, Young Hoon

AU - Lee, Byung Ki

AU - Jeong, Bong Ju

PY - 2000/10/1

Y1 - 2000/10/1

N2 - Semiconductor products are manufactured through the process of wafer fabrication, probe or electrical die sorting, assembly and final test. In particular, in this study we deal with the wafer probe process which requires several types of equipment with different capacities. As a connecting procedure of the fabrication and the assembly, the probe process may determine the capacity of whole semiconductor manufacturing. The throughput needs to be maximized as for most manufacturing lines. Because of unexpected machine failure and planned preventive maintenance, the utilization of machines has to be kept at a certain range for stabilizing the process. Hence, the production progress for each device and the utilization of machines are objectives to be maximized simultaneously, while both tend to work in opposite directions because of changeover time loss. Heuristic algorithms are developed and computationally tested. LP-based heuristic gives satisfactory results, especially for the manufacturing line with high diversity in types of machine and device.

AB - Semiconductor products are manufactured through the process of wafer fabrication, probe or electrical die sorting, assembly and final test. In particular, in this study we deal with the wafer probe process which requires several types of equipment with different capacities. As a connecting procedure of the fabrication and the assembly, the probe process may determine the capacity of whole semiconductor manufacturing. The throughput needs to be maximized as for most manufacturing lines. Because of unexpected machine failure and planned preventive maintenance, the utilization of machines has to be kept at a certain range for stabilizing the process. Hence, the production progress for each device and the utilization of machines are objectives to be maximized simultaneously, while both tend to work in opposite directions because of changeover time loss. Heuristic algorithms are developed and computationally tested. LP-based heuristic gives satisfactory results, especially for the manufacturing line with high diversity in types of machine and device.

UR - http://www.scopus.com/inward/record.url?scp=0034309436&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034309436&partnerID=8YFLogxK

U2 - 10.1080/095372800432124

DO - 10.1080/095372800432124

M3 - Article

VL - 11

SP - 660

EP - 669

JO - Production Planning and Control

JF - Production Planning and Control

SN - 0953-7287

IS - 7

ER -