Multiwafer vertical interconnects for three-dimensional integrated circuits

Rosa R. Lahiji, Katherine J. Herrick, Yongshik Lee, Alexandros Margomenos, Saeed Mohammadi, Linda P.B. Katehi

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Low-loss multiwafer vertical interconnects appropriate for a microstrip-based circuit architecture are proposed. These transitions have been designed, fabricated, and measured for 100-μm-thick silicon and GaAs substrates separately. Experimental results show excellent performance up to 20 GHz, with extremely low insertion loss (better than 0.12 and 0.38 dB for the two different silicon designs and 0.2 dB for the GaAs transition), and very good return loss (reflection of better than 12.9 and 17.3 dB for the two silicon designs, respectively, and 13.6 dB for the GaAs design). Using a high-performance transition allows for a more power-efficient interconnect, while it enables denser packaging by stacking the substrates on top of each other, as today's technologies demand.

Original languageEnglish
Pages (from-to)2699-2705
Number of pages7
JournalIEEE Transactions on Microwave Theory and Techniques
Volume54
Issue number6
DOIs
Publication statusPublished - 2006 Jun 1

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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