N-type dopant activation behaviors in poly Si1-xGex films with Ge contents and activation temperatures

S. K. Kang, J. J. Kim, B. G. Kim, D. H. Ko, H. B. Kang, C. W. Yang

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


We investigated the electrical properties and microstructures of n-type doped Si1-xGex films with Ge contents using hall measurement, four-point probe, transmission electron microscopy, and energy dispersive X-ray spectrometry to apply to gate electrode of complementary metal oxide semiconductor field effect transistor. The sheet resistance of poly Si1-xGex films implanted with arsenic decreased with the decrease of Ge content and the increase of activation temperature due to the increase of carrier mobility and activated carrier concentration. In addition, we found that the segregation of dopant increased at the grain edge and the activated carrier concentration decreased with the increase of Ge content due to higher diffusivity and lower solid solubility limit of As in poly Si1-xGex films.

Original languageEnglish
Pages (from-to)G173-G176
JournalJournal of the Electrochemical Society
Issue number3
Publication statusPublished - 2003 Mar

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry


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