Abstract
Residual stress is known to affect significantly the mechanical fracture behavior of flexible thin films. Here, an in situ chemical deposition process that allows for control of extra compressive or tensile stress in PbS thin films is suggested. This process uses the fixed convex or concave surface of a flexible substrate to impart compressive or tensile stress, respectively, after the releasing step to the flat mode. Using two technical evaluations of mechanical fracture behavior, the existence of extra stress is verified with expected enhancements of the fracture resistance only in the case of compressive stress. For example, a ≈36% improvement of the elastic modulus is confirmed by nanoindentation testing for compressively stressed PbS thin films. The bending fracture resistance is also enhanced for the compressively stressed films, as evidenced by a ≈18.5% improvement in the crack-initiating critical strain and a ≈121% increment in the fracture energy under the bending motion.
| Original language | English |
|---|---|
| Article number | 1801329 |
| Journal | Advanced Engineering Materials |
| Volume | 21 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2019 Jul |
Fingerprint
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
Cite this
}
Nanoindentation and Bending Fracture Behavior of Flexible Sulfide Thin Films Grown at Near Room Temperature With in Situ Tensile/Compressive Stress. / Kim, Da Bin; Lee, Seung Min; Jang, Jin Woo; Mohanty, Bhaskar Chandra; Cho, Yong Soo.
In: Advanced Engineering Materials, Vol. 21, No. 7, 1801329, 07.2019.Research output: Contribution to journal › Article
TY - JOUR
T1 - Nanoindentation and Bending Fracture Behavior of Flexible Sulfide Thin Films Grown at Near Room Temperature With in Situ Tensile/Compressive Stress
AU - Kim, Da Bin
AU - Lee, Seung Min
AU - Jang, Jin Woo
AU - Mohanty, Bhaskar Chandra
AU - Cho, Yong Soo
PY - 2019/7
Y1 - 2019/7
N2 - Residual stress is known to affect significantly the mechanical fracture behavior of flexible thin films. Here, an in situ chemical deposition process that allows for control of extra compressive or tensile stress in PbS thin films is suggested. This process uses the fixed convex or concave surface of a flexible substrate to impart compressive or tensile stress, respectively, after the releasing step to the flat mode. Using two technical evaluations of mechanical fracture behavior, the existence of extra stress is verified with expected enhancements of the fracture resistance only in the case of compressive stress. For example, a ≈36% improvement of the elastic modulus is confirmed by nanoindentation testing for compressively stressed PbS thin films. The bending fracture resistance is also enhanced for the compressively stressed films, as evidenced by a ≈18.5% improvement in the crack-initiating critical strain and a ≈121% increment in the fracture energy under the bending motion.
AB - Residual stress is known to affect significantly the mechanical fracture behavior of flexible thin films. Here, an in situ chemical deposition process that allows for control of extra compressive or tensile stress in PbS thin films is suggested. This process uses the fixed convex or concave surface of a flexible substrate to impart compressive or tensile stress, respectively, after the releasing step to the flat mode. Using two technical evaluations of mechanical fracture behavior, the existence of extra stress is verified with expected enhancements of the fracture resistance only in the case of compressive stress. For example, a ≈36% improvement of the elastic modulus is confirmed by nanoindentation testing for compressively stressed PbS thin films. The bending fracture resistance is also enhanced for the compressively stressed films, as evidenced by a ≈18.5% improvement in the crack-initiating critical strain and a ≈121% increment in the fracture energy under the bending motion.
UR - http://www.scopus.com/inward/record.url?scp=85064046594&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85064046594&partnerID=8YFLogxK
U2 - 10.1002/adem.201801329
DO - 10.1002/adem.201801329
M3 - Article
AN - SCOPUS:85064046594
VL - 21
JO - Advanced Engineering Materials
JF - Advanced Engineering Materials
SN - 1438-1656
IS - 7
M1 - 1801329
ER -