Nanowire arrays for thermoelectric devices

Woochul Kim, Alexis R. Abramson, Scott T. Huxtable, Arun Majumdar, Yiying Wu, Lynn Trahey, Peidong Yang, Angelica Stacy, Timothy D. Sands, Ronald Gronsky

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study reports on the fabrication and characterization of two prototype thermoelectric devices constructed of either silicon (Si) or bismuth telluride (Bi 2 Te 3 ) nanowire arrays. The growth mechanisms and fabrication procedures of the Si and Bi 2 Te 3 devices are different as described in this paper. To characterize the thermoelectric device components, current-voltage (I-V) characteristics were first used to estimate their performance. For the Si device, the I-V characteristics suggest ohmic contacts at the metal-semiconductor junction. For the Bi 2 Te 3 device, the I-V characteristics curve showed a rectifying contact. Either low doping of the Bi 2 Te 2 or surface contamination, i.e. native oxide, may cause the rectifying contact. The reversible Peltier effects occurring within the Si device were analyzed using a micro-thermocouple. Results indicated possible limitations of using Si nanowire arrays for the thermoelectric device.

Original languageEnglish
Title of host publicationProceedings of the 003 ASME Summer Heat Transfer Conference, Volume 1
Pages101-104
Number of pages4
Publication statusPublished - 2003 Dec 1
Event2003 ASME Summer Heat Transfer Conference (HT2003) - Las Vegas, NV, United States
Duration: 2003 Jul 212003 Jul 23

Publication series

NameProceedings of the ASME Summer Heat Transfer Conference
Volume2003

Other

Other2003 ASME Summer Heat Transfer Conference (HT2003)
CountryUnited States
CityLas Vegas, NV
Period03/7/2103/7/23

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Kim, W., Abramson, A. R., Huxtable, S. T., Majumdar, A., Wu, Y., Trahey, L., Yang, P., Stacy, A., Sands, T. D., & Gronsky, R. (2003). Nanowire arrays for thermoelectric devices. In Proceedings of the 003 ASME Summer Heat Transfer Conference, Volume 1 (pp. 101-104). (Proceedings of the ASME Summer Heat Transfer Conference; Vol. 2003).