Networked SSD: Flash Memory Interconnection Network for High-Bandwidth SSD

Jiho Kim, Seokwon Kang, Yongjun Park, John Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As the flash memory performance increases with more bandwidth, the flash memory channel or the interconnect is becoming a bigger bottleneck to enable high performance SSD system. However, the bandwidth of the flash memory interconnect is not increasing at the same rate as the flash memory. In addition, current flash memory bus is based on dedicated signaling where separate control signals are used for communication between the flash channel controller and the flash memory chip. In this work, we propose to exploit packetized communication to improve the effective flash memory interconnect bandwidth and propose packetized SSD (pSSD) system architecture. We first show how packetized communication can be exploited and the microarchitectural changes required. We then propose the Omnibus topology for flash memory interconnect to enable a packetized network SSD (pnSSD) among the flash memory - a 2D bus-based organization that maintains a 'bus' organization for the interconnect while enabling direct communication between the flash memory chips. The pnSSD architecture enables a new type of garbage collection that we refer to as spatial garbage collection that significantly reduces the interference between I/O requests and garbage collection. Our detailed evaluation of pnSSD shows 82% improvement in I/O latency with no garbage collection (GC) while improving I/O latency by 9.71× when GC occurs in parallel with I/O operation, through spatial garbage collection.

Original languageEnglish
Title of host publicationProceedings - 2022 55th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2022
PublisherIEEE Computer Society
Pages388-403
Number of pages16
ISBN (Electronic)9781665462723
DOIs
Publication statusPublished - 2022
Event55th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2022 - Chicago, United States
Duration: 2022 Oct 12022 Oct 5

Publication series

NameProceedings of the Annual International Symposium on Microarchitecture, MICRO
Volume2022-October
ISSN (Print)1072-4451

Conference

Conference55th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2022
Country/TerritoryUnited States
CityChicago
Period22/10/122/10/5

Bibliographical note

Funding Information:
We would like to thank the anonymous reviewers for their valuablecomments. This work was supported in part by IITP grant funded by MSIT (No. 2020-0-01303, 2020-0-01309) and in part by NRF-2020R1A2B5B0100168713.

Publisher Copyright:
© 2022 IEEE.

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture

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