New packaging method of field emission display using silicon-to-ITO coated glass bonding

Jee Won Jeong, Byeong Kwon Ju, Woo Beom Choi, Duck Jung Lee, Yun Hi Lee, Nam Yang Lee, Seong Jae Jung, Doo Jin Choi, Myung Hwan Oh

Research output: Contribution to conferencePaperpeer-review

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