Nickel mono-silicide formation using a photo-thermal process assisted by ultra-violet laser

Sang Min Jung, Jin Hwan Kim, Chul Jin Park, Moo Whan Shin

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Photo-thermal processing assisted by laser irradiation is proposed as a novel method to control the phase of nickel silicide with reduction in the diffusion of nickel into the silicon substrate. The third harmonics of Nd3+:Y3Al5O12 laser (wavelength, 355 nm) is used for photo-thermal processing. Optical and thermal simulations are performed to obtain an optimum thickness (30 nm) of the nickel film for photo-thermal processing and to predict the temperature profile of the nickel-silicon interface during laser irradiation. It is confirmed that Ni2Si, NiSi and NiSi2 phase are effectively formed at the laser energy densities of 15, 20–40, and 50 mJ/cm2, respectively. We demonstrate that the phases of nickel silicide determined by Raman spectroscopy and X-ray diffraction analyses are in good agreement with those predicted by the heat transfer simulation. In addition, undesirable diffusion of nickel into silicon substrate is considerably reduced by instantaneous photo-thermal processing using the nano-second laser (pulse duration, 6 ns).

Original languageEnglish
Pages (from-to)263-268
Number of pages6
JournalMaterials Science in Semiconductor Processing
Volume75
DOIs
Publication statusPublished - 2018 Mar 1

Fingerprint

Ultraviolet lasers
Nickel
ultraviolet lasers
Silicon
nickel
Laser beam effects
lasers
Lasers
silicon
Substrates
thermal simulation
Raman spectroscopy
Laser pulses
irradiation
Heat transfer
X ray diffraction
Wavelength
temperature profiles
Hot Temperature
pulse duration

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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abstract = "Photo-thermal processing assisted by laser irradiation is proposed as a novel method to control the phase of nickel silicide with reduction in the diffusion of nickel into the silicon substrate. The third harmonics of Nd3+:Y3Al5O12 laser (wavelength, 355 nm) is used for photo-thermal processing. Optical and thermal simulations are performed to obtain an optimum thickness (30 nm) of the nickel film for photo-thermal processing and to predict the temperature profile of the nickel-silicon interface during laser irradiation. It is confirmed that Ni2Si, NiSi and NiSi2 phase are effectively formed at the laser energy densities of 15, 20–40, and 50 mJ/cm2, respectively. We demonstrate that the phases of nickel silicide determined by Raman spectroscopy and X-ray diffraction analyses are in good agreement with those predicted by the heat transfer simulation. In addition, undesirable diffusion of nickel into silicon substrate is considerably reduced by instantaneous photo-thermal processing using the nano-second laser (pulse duration, 6 ns).",
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Nickel mono-silicide formation using a photo-thermal process assisted by ultra-violet laser. / Jung, Sang Min; Kim, Jin Hwan; Park, Chul Jin; Shin, Moo Whan.

In: Materials Science in Semiconductor Processing, Vol. 75, 01.03.2018, p. 263-268.

Research output: Contribution to journalArticle

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AB - Photo-thermal processing assisted by laser irradiation is proposed as a novel method to control the phase of nickel silicide with reduction in the diffusion of nickel into the silicon substrate. The third harmonics of Nd3+:Y3Al5O12 laser (wavelength, 355 nm) is used for photo-thermal processing. Optical and thermal simulations are performed to obtain an optimum thickness (30 nm) of the nickel film for photo-thermal processing and to predict the temperature profile of the nickel-silicon interface during laser irradiation. It is confirmed that Ni2Si, NiSi and NiSi2 phase are effectively formed at the laser energy densities of 15, 20–40, and 50 mJ/cm2, respectively. We demonstrate that the phases of nickel silicide determined by Raman spectroscopy and X-ray diffraction analyses are in good agreement with those predicted by the heat transfer simulation. In addition, undesirable diffusion of nickel into silicon substrate is considerably reduced by instantaneous photo-thermal processing using the nano-second laser (pulse duration, 6 ns).

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