Density distributions of radicals in the large-area silicon nitride (Si3N4) plasma-enhanced chemical vapor deposition (PECVD) process were measured using a spatially resolvable optical emission spectrometer (SROES). To determine the qualitative distribution of a target radical, the authors used optical actinometry with nitrogen (N2) gas as an actinometer. To compare the SROES data and process results, the thickness of the deposited Si3N4 thin films using an ellipsometer was measured. By introducing nitrogen-based optical actinometry, the authors obtained very good agreement between the experimental results of the distributions of atomic nitrogen radical and the deposited thicknesses of Si3N4 thin films. Based on these experimental results, the uniformity of the process plasma in the PECVD process at different applied radio frequency powers was analyzed.
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - 2013 May 1|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films