Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages

Taewon Yoo, Kwangin Kim, Patrick Han, Wonbong Jang, Haksoo Han

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε′) and loss modulus (ε″) were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature.[Figure not available: see fulltext.]

Original languageEnglish
Pages (from-to)776-786
Number of pages11
JournalMacromolecular Research
Volume23
Issue number8
DOIs
Publication statusPublished - 2015 Aug 21

Fingerprint

Diamines
Polyimides
Thermal expansion
Residual stresses
Crosslinking
Dicarboxylic Acids
Sulfones
Polymer films
Ether
Temperature
Ethers
Polymers
X ray diffraction
Thin films
Acids
2-norbornene
Substrates

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Polymers and Plastics
  • Organic Chemistry
  • Materials Chemistry

Cite this

Yoo, Taewon ; Kim, Kwangin ; Han, Patrick ; Jang, Wonbong ; Han, Haksoo. / Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages. In: Macromolecular Research. 2015 ; Vol. 23, No. 8. pp. 776-786.
@article{d9b82fad05814b529413c76c23901eb5,
title = "Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages",
abstract = "The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε′) and loss modulus (ε″) were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature.[Figure not available: see fulltext.]",
author = "Taewon Yoo and Kwangin Kim and Patrick Han and Wonbong Jang and Haksoo Han",
year = "2015",
month = "8",
day = "21",
doi = "10.1007/s13233-015-3104-3",
language = "English",
volume = "23",
pages = "776--786",
journal = "Macromolecular Research",
issn = "1598-5032",
publisher = "Polymer Society of Korea",
number = "8",

}

Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages. / Yoo, Taewon; Kim, Kwangin; Han, Patrick; Jang, Wonbong; Han, Haksoo.

In: Macromolecular Research, Vol. 23, No. 8, 21.08.2015, p. 776-786.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages

AU - Yoo, Taewon

AU - Kim, Kwangin

AU - Han, Patrick

AU - Jang, Wonbong

AU - Han, Haksoo

PY - 2015/8/21

Y1 - 2015/8/21

N2 - The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε′) and loss modulus (ε″) were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature.[Figure not available: see fulltext.]

AB - The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε′) and loss modulus (ε″) were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature.[Figure not available: see fulltext.]

UR - http://www.scopus.com/inward/record.url?scp=84939567300&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84939567300&partnerID=8YFLogxK

U2 - 10.1007/s13233-015-3104-3

DO - 10.1007/s13233-015-3104-3

M3 - Article

AN - SCOPUS:84939567300

VL - 23

SP - 776

EP - 786

JO - Macromolecular Research

JF - Macromolecular Research

SN - 1598-5032

IS - 8

ER -