Novel and high-yield fabrication of electroplated 3D micro-coils for MEMS and microelectronics

Jun Bo Yoon, Chul Hi Han, Euisik Yoon, Choong Ki Kim

Research output: Contribution to journalConference article

8 Citations (Scopus)

Abstract

A novel and high-yield process is presented to fabricate electroplated 3D micro-coils for MEMS and microelectronics. The 3D Solenoid-type Integrated Inductor (SI2) is decomposed into two parts, bottom conductor lines and air bridges. The bridges are formed by only one electroplating step. This single-step fabrication of the electroplated air bridges is possible by forming the 3D photoresist mold with a Multi-Exposure and Single Development method (MESD). We have successfully demonstrated 3D micro-coils with or without a core. This method is so easy and simple that we can dramatically improve the fabrication yield, which is the hardest obstacle in the various 3D micro-coil fabrication methods. Also, this method has good IC process compatibility owing to low process temperature and the monolithic feature.

Original languageEnglish
Pages (from-to)233-240
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3511
DOIs
Publication statusPublished - 1998 Dec 1
EventMicromachining and Microfabrication Process Technology IV - Santa Clara, CA, United States
Duration: 1998 Sep 211998 Sep 22

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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