Optimization of via structure in multilayer PCB for high speed signal transmission

Bong Gyu Kang, Hyun Kim, Hee Do Kang, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

44-layers PCB (Printed Circuit Board) for semiconductor test has been analyzed and optimized to improve the transmission performance. By dividing the PCB to subsections and analyzing each section, stub resonance reported in [1] brings the degeneration of transmission performance. To resolve this problem, the blind via can be used, but this technique is not recommended due to high cost and additional process. Hence, this paper proposes that the size of a clearance pad can be optimized to shift the resonance frequency to a higher frequency instead of adopting a blind via. When the size of the clearance pad is optimized, the S21 is improved to about -7 dB in several cases. For the analysis of the entire structure, the PCB is divided into several portions and then, the performance of each portion is analyzed by the 3D full EM simulation. These results are synthesized by circuit simulation. This methodology is verified by comparing between simulation results and measurement results.

Original languageEnglish
Title of host publication2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages105-108
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
Duration: 2008 Dec 102008 Dec 12

Publication series

Name2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Other

Other2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
CountryKorea, Republic of
CitySeoul
Period08/12/1008/12/12

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Kang, B. G., Kim, H., Kang, H. D., & Yook, J. G. (2008). Optimization of via structure in multilayer PCB for high speed signal transmission. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 105-108). [4736010] (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). https://doi.org/10.1109/EDAPS.2008.4736010