Optofluidic packaging of silicon microchips for applications in light emitting devices

S. E. Chung; S. A. Lee; J. Kim; S. Kwon

doi:10.1109/SENSOR.2009.5285518

Optofluidic packaging of silicon microchips for applications in light emitting devices

S. E. Chung, S. A. Lee, J. Kim, S. Kwon

Department of Electrical and Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs).

Original language	English
Title of host publication	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	240-243
Number of pages	4
DOIs	https://doi.org/10.1109/SENSOR.2009.5285518
Publication status	Published - 2009
Event	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: 2009 Jun 21 → 2009 Jun 25

Publication series

Name	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country	United States
City	Denver, CO
Period	09/6/21 → 09/6/25

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/SENSOR.2009.5285518

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Chung, S. E., Lee, S. A., Kim, J., & Kwon, S. (2009). Optofluidic packaging of silicon microchips for applications in light emitting devices. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 240-243). [5285518] (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285518

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title = "Optofluidic packaging of silicon microchips for applications in light emitting devices",

abstract = "We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs).",

author = "Chung, {S. E.} and Lee, {S. A.} and J. Kim and S. Kwon",

year = "2009",

doi = "10.1109/SENSOR.2009.5285518",

language = "English",

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series = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems",

pages = "240--243",

booktitle = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems",

note = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems ; Conference date: 21-06-2009 Through 25-06-2009",

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Chung, SE, Lee, SA, Kim, J & Kwon, S 2009, Optofluidic packaging of silicon microchips for applications in light emitting devices. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285518, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 240-243, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 09/6/21. https://doi.org/10.1109/SENSOR.2009.5285518

Optofluidic packaging of silicon microchips for applications in light emitting devices. / Chung, S. E.; Lee, S. A.; Kim, J.; Kwon, S.

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 240-243 5285518 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs).

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Chung SE, Lee SA, Kim J, Kwon S. Optofluidic packaging of silicon microchips for applications in light emitting devices. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 240-243. 5285518. (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285518