TY - GEN
T1 - Optofluidic packaging of silicon microchips for applications in light emitting devices
AU - Chung, S. E.
AU - Lee, S. A.
AU - Kim, J.
AU - Kwon, S.
PY - 2009
Y1 - 2009
N2 - We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs).
AB - We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs).
UR - http://www.scopus.com/inward/record.url?scp=71449104438&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=71449104438&partnerID=8YFLogxK
U2 - 10.1109/SENSOR.2009.5285518
DO - 10.1109/SENSOR.2009.5285518
M3 - Conference contribution
AN - SCOPUS:71449104438
SN - 9781424441938
T3 - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
SP - 240
EP - 243
BT - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
T2 - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Y2 - 21 June 2009 through 25 June 2009
ER -