Package-level integrated antennas based on LTCC technology

Sang Hyuk Wi, Yong Bin Sun, In Sang Song, Sung Hoon Choa, Il Suek Koh, Yong Shik Lee, Jong Gwan Yook

Research output: Contribution to journalArticle

86 Citations (Scopus)

Abstract

We propose a novel package topology integrating multilayer miniaturized antennas. Such a functional package is suitable for the design of a system-on-chip device, or of system-on-package applications. A stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process. The overall size of the package is 10.3 × 10.3 × 1.3 mm3, and this package contains an 8.3 × 8.3 × 0.7 mm3 internal space for the integration of chip-scale packaged components. The package is mounted on a 20 × 20 mm2 ground plane to miniaturize the volume of the system. The antenna is designed to have two neighboring resonant frequencies at 5.264 and 5.355 GHz, resulting in a 140 MHz impedance bandwidth. However, the measured resonant frequencies occur at slightly higher frequencies due to manufacturing tolerances. Radiation patterns are similar to a conventional patch antenna. In addition, various parasitic effects rooted in the package size, ground size, antenna height, SMA connector, via misalignment, and the number of via holes and their locations are fully investigated.

Original languageEnglish
Pages (from-to)2190-2197
Number of pages8
JournalIEEE Transactions on Antennas and Propagation
Volume54
Issue number8
DOIs
Publication statusPublished - 2006 Aug 1

Fingerprint

Antennas
Microstrip antennas
Natural frequencies
Acoustic impedance
Antenna grounds
Directional patterns (antenna)
Multilayers
Topology
Bandwidth
Temperature
System-on-package
System-on-chip

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Wi, Sang Hyuk ; Sun, Yong Bin ; Song, In Sang ; Choa, Sung Hoon ; Koh, Il Suek ; Lee, Yong Shik ; Yook, Jong Gwan. / Package-level integrated antennas based on LTCC technology. In: IEEE Transactions on Antennas and Propagation. 2006 ; Vol. 54, No. 8. pp. 2190-2197.
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Package-level integrated antennas based on LTCC technology. / Wi, Sang Hyuk; Sun, Yong Bin; Song, In Sang; Choa, Sung Hoon; Koh, Il Suek; Lee, Yong Shik; Yook, Jong Gwan.

In: IEEE Transactions on Antennas and Propagation, Vol. 54, No. 8, 01.08.2006, p. 2190-2197.

Research output: Contribution to journalArticle

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